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SN74LS385NP3

Texas Instruments

SN74LS385NP3 by Texas Instruments

SN74LS385NP3 by Texas Instruments is a 20-terminal TTL digital arithmetic circuit with temp range of 0-70°C. It has a rectangular plastic/epoxy package style and through-hole terminal form. Ideal for commercial applications requiring precise arithmetic calculations in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,345 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,345

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Digiode

USA . 1,805 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,805

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 857 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

857

$4.000

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-

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Andel Nordic

Denmark . 3,334 parts In-Stock

1+ parts

$4.250

100+ parts

-

1k+ parts

$4.080

10k+ parts

$4.080

3,334

$4.250

-

$4.080

$4.080

AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$10.577

100+ parts

-

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341

$10.577

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Parana Technologies

USA . 924 parts In-Stock

1+ parts

$20.599

100+ parts

-

1k+ parts

$20.695

10k+ parts

-

924

$20.599

-

$20.695

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DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$22.682

100+ parts

$20.868

1k+ parts

-

10k+ parts

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295

$22.682

$20.868

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ChromeModa Solutions

Germany . 3,388 parts In-Stock

1+ parts

$23.145

100+ parts

$18.979

1k+ parts

-

10k+ parts

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3,388

$23.145

$18.979

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$23.145

100+ parts

$21.988

1k+ parts

$20.830

10k+ parts

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400

$23.145

$21.988

$20.830

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Corphita

USA . 2,864 parts In-Stock

1+ parts

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2,864

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Overview

Discover the superior quality and reliability of the SN74LS385NP3 by Texas Instruments, a leading manufacturer in digital arithmetic circuits. This versatile component is perfect for a wide range of applications, offering unmatched performance and precision. Designed with a focus on value and efficiency, this product provides customers with the benefits of seamless operation and enhanced functionality. Upgrade your projects with the SN74LS385NP3 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components of the circuit, ensuring longevity and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic systems and circuit boards.

No. of Terminals: 20

With 20 terminals, this circuit can handle complex digital arithmetic operations efficiently and effectively.

Package Style (Meter): IN-LINE

In-line package style makes it easy to install and connect the circuit within a larger electronic setup.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this circuit can withstand high temperature environments, making it versatile for various applications.

Minimum Operating Temperature: 0 °C

The circuit can also operate efficiently in low temperature environments, ensuring reliable performance in diverse conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in wiring and connections, allowing for easier integration with other components.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the circuit meets industry standards and can be used in commercial electronic devices and systems.

Technology: TTL

TTL technology offers fast and efficient digital signal processing, making this circuit suitable for high-speed arithmetic calculations.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy soldering and secure connections, ensuring stable operation of the circuit.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this circuit can easily be integrated into standard printed circuit boards, simplifying the installation process.

Technical Specifications

Digital Arithmetic Circuits SN74LS385NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS385NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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