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CD74HC147PWTG4

Texas Instruments

CD74HC147PWTG4 by Texas Instruments

CD74HC147PWTG4 by Texas Instruments is a 9-bit digital arithmetic circuit with 240ns propagation delay. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2-6V, it features a small outline package and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,168 parts In-Stock

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Digiode

USA . 2,626 parts In-Stock

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2,626

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Distributors (Availability)

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$9.633

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368

$9.633

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One Stop Electronics

USA . 1,099 parts In-Stock

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$24.000

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1,099

$24.000

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Parana Technologies

USA . 681 parts In-Stock

1+ parts

$27.565

100+ parts

$2,559.836

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$24.809

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681

$27.565

$2,559.836

$24.809

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DigiPath Technology Company

USA . 1,583 parts In-Stock

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$30.353

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1,583

$30.353

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ChromeModa Solutions

Germany . 2,061 parts In-Stock

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$30.972

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$25.397

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2,061

$30.972

$25.397

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$30.972

100+ parts

$29.423

1k+ parts

$27.875

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182

$30.972

$29.423

$27.875

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Native Components

USA . 550 parts In-Stock

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$41.820

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$40.147

550

$41.820

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$40.147

Northwest PG Solutions

USA . 106 parts In-Stock

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$46.002

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106

$46.002

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Andel Nordic

Denmark . 1,327 parts In-Stock

1+ parts

$142.779

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$137.068

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$137.068

1,327

$142.779

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$137.068

$137.068

Corphita

USA . 3,676 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74HC147PWTG4 Digital Arithmetic Circuit. Designed with precision and innovation, this product offers unmatched performance in a compact and durable package. Ideal for a wide range of applications, this circuit provides efficient and accurate results for your digital arithmetic needs. Trust Texas Instruments to deliver exceptional value and benefits, making your projects stand out from the rest. Elevate your work with the CD74HC147PWTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

No. of Bits: 9

Offers high precision in digital calculations and operations.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal voltage for efficient performance and power consumption.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and rugged environments.

Technology: CMOS

Highly efficient and low power consumption technology for digital circuits.

Technical Specifications

Digital Arithmetic Circuits CD74HC147PWTG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

9 TO 4 LINE PRIORITY ENCODER

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CD74HC147PWTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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