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SNJ54S85W

Texas Instruments

SNJ54S85W by Texas Instruments

SNJ54S85W by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates at a supply voltage of 5V and has a propagation delay of 16.5ns. This MILITARY-grade component is used in applications requiring fast arithmetic calculations in harsh environments.

Median Price

$12.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 899 parts In-Stock

1+ parts

$12.000

100+ parts

$7.200

1k+ parts

$6.900

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899

$12.000

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$6.900

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Vyrian

USA . 5,957 parts In-Stock

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Digiode

USA . 3,198 parts In-Stock

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Microfarads

USA . 867 parts In-Stock

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Electronic Expediters

USA . 451 parts In-Stock

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Resion

USA . 13 parts In-Stock

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Andel Nordic

Denmark . 2,116 parts In-Stock

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$7.750

100+ parts

-

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$7.440

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$7.440

2,116

$7.750

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$7.440

$7.440

AZTECH Wire

Italy . 876 parts In-Stock

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$18.699

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876

$18.699

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Parana Technologies

USA . 509 parts In-Stock

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$21.277

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$21.585

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509

$21.277

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$21.585

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DigiPath Technology Company

USA . 927 parts In-Stock

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$23.429

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$21.555

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927

$23.429

$21.555

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IDEA Electronic Components Group

UK . 731 parts In-Stock

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$23.907

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$22.712

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$21.516

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731

$23.907

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ChromeModa Solutions

Germany . 79 parts In-Stock

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$23.907

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$19.604

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One Stop Electronics

USA . 1,351 parts In-Stock

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$30.000

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Corphita

USA . 3,638 parts In-Stock

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Kepictronics

USA . 64 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNJ54S85W from Texas Instruments. Crafted with precision and reliability in mind, this ceramic, glass-sealed package offers unmatched quality and performance for a wide range of applications. From military-grade screening to its true output polarity, this flatpack marvel boasts a multitude of advantages. Discover the value of fast propagation delays, dual terminal positions, and a nominal supply voltage of 5V. Choose Texas Instruments for cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level, making it compatible with common power sources.

Propagation Delay (tpd): 16.5 ns

Fast response time for processing arithmetic calculations, enhancing overall performance.

Temperature Grade: MILITARY

Designed to meet stringent military specifications for operation in rugged conditions.

Technology: TTL

Utilizes TTL technology known for its high-speed operation and reliability in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54S85W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

S

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54S85W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-179-8099, 5962011798099

NIIN

011798099

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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