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SN74S350D3

Texas Instruments

SN74S350D3 by Texas Instruments

SN74S350D3 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals and a supply voltage of 5V. It operates b/w 0-70°C, suitable for commercial applications. This surface-mount package in plastic/epoxy material is ideal for compact designs requiring precise calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,484 parts In-Stock

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4,484

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Vyrian

USA . 3,987 parts In-Stock

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3,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$11.444

100+ parts

-

1k+ parts

$10.986

10k+ parts

$10.986

50

$11.444

-

$10.986

$10.986

AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$13.196

100+ parts

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376

$13.196

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Parana Technologies

USA . 1,650 parts In-Stock

1+ parts

$19.212

100+ parts

-

1k+ parts

$19.254

10k+ parts

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1,650

$19.212

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$19.254

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DigiPath Technology Company

USA . 884 parts In-Stock

1+ parts

$21.155

100+ parts

$19.463

1k+ parts

-

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884

$21.155

$19.463

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IDEA Electronic Components Group

UK . 955 parts In-Stock

1+ parts

$21.587

100+ parts

$20.508

1k+ parts

$19.428

10k+ parts

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955

$21.587

$20.508

$19.428

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ChromeModa Solutions

Germany . 156 parts In-Stock

1+ parts

$21.587

100+ parts

$17.701

1k+ parts

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156

$21.587

$17.701

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One Stop Electronics

USA . 752 parts In-Stock

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$58.000

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752

$58.000

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Corphita

USA . 1,767 parts In-Stock

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1,767

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Overview

Upgrade your digital arithmetic circuits with the high-quality SN74S350D3 by Texas Instruments. Designed with precision and reliability in mind, this product offers unmatched performance and efficiency for various applications. Transform your projects with ease using this versatile component that guarantees seamless integration and optimal functionality. Trust in Texas Instruments' reputation for excellence and innovation to deliver the best-in-class solutions for your electronic needs. Choose the SN74S350D3 for superior quality, value, and performance that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a cost-effective and lightweight solution for the digital arithmetic circuit.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and improving overall product reliability.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with common power sources, making integration into existing systems more straightforward.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this digital arithmetic circuit can be used in a wide range of environments without risking overheating.

Technology: TTL

The use of TTL technology ensures high-speed performance and reliable operation, making this product suitable for demanding arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits SN74S350D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74S350D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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