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SN74185AN1

Texas Instruments

SN74185AN1 by Texas Instruments

SN74185AN1 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals and a supply voltage of 5V. It operates in commercial temperature range from 0 to 70°C, making it suitable for various applications requiring precise calculations and logic operations. The package style is in-line rectangular plastic/epoxy, ideal for through-hole mounting in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,191 parts In-Stock

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7,191

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Digiode

USA . 4,771 parts In-Stock

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4,771

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Distributors (Availability)

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AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$10.154

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236

$10.154

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Andel Nordic

Denmark . 2,541 parts In-Stock

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$10.468

100+ parts

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$10.050

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$10.050

2,541

$10.468

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$10.050

$10.050

Parana Technologies

USA . 1,715 parts In-Stock

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$27.659

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$38.516

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1,715

$27.659

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$38.516

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DigiPath Technology Company

USA . 1,147 parts In-Stock

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$30.456

100+ parts

$28.020

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1,147

$30.456

$28.020

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ChromeModa Solutions

Germany . 4,867 parts In-Stock

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$31.078

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$25.484

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4,867

$31.078

$25.484

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IDEA Electronic Components Group

UK . 946 parts In-Stock

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$31.078

100+ parts

$29.524

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$27.970

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946

$31.078

$29.524

$27.970

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One Stop Electronics

USA . 1,310 parts In-Stock

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$55.000

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$55.000

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Corphita

USA . 1,766 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SN74185AN1. Trusted for its high-quality manufacturing and reliable performance, this rectangular package boasts a nominal supply voltage of 5V, making it ideal for a wide range of applications. From calculating complex algorithms to processing data with precision, this TTL technology-based product offers customers unmatched value, benefits, and advantages. Elevate your projects with the SN74185AN1 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as package body material provides good insulation and helps protect the internal components of the digital arithmetic circuit from environmental factors such as moisture and dust.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and placement within electronic circuits and systems, making it a versatile option for various applications.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the design and implementation process in electronic systems.

Power Supplies (V): 5

Consistent power supply at 5V helps maintain stable operation of the digital arithmetic circuit, enhancing reliability and performance in different operating conditions.

No. of Terminals: 16

With 16 terminals, this digital arithmetic circuit offers sufficient connectivity options for interfacing with other components or systems, enabling versatile and customized configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy placement and routing of connections, contributing to a more organized and space-efficient layout when integrating the digital arithmetic circuit within a system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C provides flexibility in operating environments, allowing the digital arithmetic circuit to function reliably even in elevated temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance of 0°C ensures that the digital arithmetic circuit can operate effectively in varying temperature ranges, making it suitable for diverse applications.

Terminal Position: DUAL

The dual terminal position offers redundancy and enhanced connectivity options, enabling secure and stable connections in the digital arithmetic circuit's interface with external devices or systems.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this digital arithmetic circuit is suitable for various business and consumer electronics products, offering reliability and performance in standard operating environments.

Technology: TTL

Utilizing TTL (Transistor-Transistor Logic) technology ensures fast response times and low power consumption, making the digital arithmetic circuit energy-efficient and suitable for high-speed digital signal processing applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure mechanical connections and easy soldering processes during assembly, ensuring robust and reliable connections for the digital arithmetic circuit in electronic systems.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the digital arithmetic circuit offers compatibility with standard electronic component spacing and facilitates easy integration and assembly within circuit boards or systems.

Technical Specifications

Digital Arithmetic Circuits SN74185AN1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74185AN1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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