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SNJ54AC11520J

Texas Instruments

SNJ54AC11520J by Texas Instruments

SNJ54AC11520J by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals. Operating at temperatures from -55°C to 125°C, it supports power supplies of 3.3V and 5V. This MILITARY-grade component in CERAMIC package is ideal for applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,263 parts In-Stock

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9,263

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Digiode

USA . 1,642 parts In-Stock

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1,642

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Distributors (Availability)

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Andel Nordic

Denmark . 4,956 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

$2.514

10k+ parts

$2.514

4,956

$2.619

-

$2.514

$2.514

AZTECH Wire

Italy . 889 parts In-Stock

1+ parts

$7.309

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889

$7.309

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One Stop Electronics

USA . 787 parts In-Stock

1+ parts

$9.000

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-

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787

$9.000

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Parana Technologies

USA . 59 parts In-Stock

1+ parts

$19.894

100+ parts

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$19.848

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59

$19.894

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$19.848

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DigiPath Technology Company

USA . 757 parts In-Stock

1+ parts

$21.906

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757

$21.906

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ChromeModa Solutions

Germany . 4,822 parts In-Stock

1+ parts

$22.353

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$18.329

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4,822

$22.353

$18.329

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IDEA Electronic Components Group

UK . 1,349 parts In-Stock

1+ parts

$22.353

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$21.235

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$20.118

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1,349

$22.353

$21.235

$20.118

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Corphita

USA . 4,450 parts In-Stock

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4,450

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Overview

Elevate your digital arithmetic circuits with the SNJ54AC11520J by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology to meet your needs. This versatile component offers a wide range of applications, providing exceptional value and performance in military-grade environments. Upgrade your projects with ease and precision, thanks to the innovative design and superior capabilities of the SNJ54AC11520J. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal performance and mechanical strength, making them ideal for high-power and high-temperature applications.

Screening Level: 38535Q/M;38534H;883B

This screening level ensures that the product meets strict quality standards and reliability requirements, making it suitable for critical military and aerospace applications.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, offering flexibility in power requirements for different system configurations.

No. of Terminals: 20

Provides a sufficient number of terminals for connecting various input and output signals without the need for additional external components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain reliable performance under extreme heat.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product can function effectively in cold environments without the risk of performance degradation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product efficient and versatile in digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54AC11520J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54AC11520J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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