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SNJ54148J-00

Texas Instruments

SNJ54148J-00 by Texas Instruments

SNJ54148J-00 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 25ns. It is used in military-grade applications, featuring a temperature range from -55 to 125°C and a max power supply current of 60mA. The package style is in-line with dual terminals, making it suitable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,465 parts In-Stock

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Digiode

USA . 3,692 parts In-Stock

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3,692

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Distributors (Availability)

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Andel Nordic

Denmark . 427 parts In-Stock

1+ parts

$11.462

100+ parts

-

1k+ parts

$11.003

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$11.003

427

$11.462

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$11.003

$11.003

Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$15.065

100+ parts

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$15.479

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1,380

$15.065

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$15.479

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DigiPath Technology Company

USA . 533 parts In-Stock

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$16.588

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533

$16.588

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ChromeModa Solutions

Germany . 6,693 parts In-Stock

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$16.927

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$13.880

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6,693

$16.927

$13.880

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IDEA Electronic Components Group

UK . 1,605 parts In-Stock

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$16.927

100+ parts

$16.081

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$15.234

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1,605

$16.927

$16.081

$15.234

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AZTECH Wire

Italy . 319 parts In-Stock

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$19.091

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319

$19.091

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One Stop Electronics

USA . 797 parts In-Stock

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$52.000

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$52.000

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Corphita

USA . 76 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the SNJ54148J-00, a high-quality digital arithmetic circuit designed to meet your demanding requirements. Perfect for military-grade applications, this versatile component offers unparalleled performance and reliability. With a nominal supply voltage of 5V and a propagation delay of just 25ns, this compact package ensures efficient operation in a wide range of settings. Trust Texas Instruments to deliver superior products that provide exceptional value and benefits to customers seeking top-of-the-line solutions in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides strong protection for the circuits, ensuring durability and reliability.

No. of Bits: 8

With 8 bits, this product can handle a wide range of calculations and operations, making it versatile.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many systems and power sources.

Propagation Delay (tpd): 25 ns

The low propagation delay ensures fast and efficient processing of data, leading to quick results.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, making it suitable for use in demanding environments such as military applications.

Technical Specifications

Digital Arithmetic Circuits SNJ54148J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54148J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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