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SNC54AS264J

Texas Instruments

SNC54AS264J by Texas Instruments

SNC54AS264J by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 16 terminals. Operating temperature ranges from -55°C to 125°C, suitable for military applications. Utilizes TTL technology in a ceramic package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,334 parts In-Stock

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Digiode

USA . 2,247 parts In-Stock

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2,247

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 300 parts In-Stock

1+ parts

$5.887

100+ parts

-

1k+ parts

$5.652

10k+ parts

$5.652

300

$5.887

-

$5.652

$5.652

AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$13.332

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255

$13.332

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Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

$25.838

100+ parts

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$26.437

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2,109

$25.838

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$26.437

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One Stop Electronics

USA . 1,441 parts In-Stock

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$28.000

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1,441

$28.000

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DigiPath Technology Company

USA . 2,113 parts In-Stock

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$28.450

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$26.174

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2,113

$28.450

$26.174

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ChromeModa Solutions

Germany . 4,157 parts In-Stock

1+ parts

$29.031

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$23.805

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4,157

$29.031

$23.805

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IDEA Electronic Components Group

UK . 133 parts In-Stock

1+ parts

$29.031

100+ parts

$27.579

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$26.128

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133

$29.031

$27.579

$26.128

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Corphita

USA . 4,479 parts In-Stock

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4,479

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Overview

Upgrade your digital arithmetic circuits with the high-quality SNC54AS264J by Texas Instruments. Designed for military-grade applications, this product offers unmatched reliability and performance. Whether you're looking to enhance your communication systems or aerospace equipment, this component is sure to deliver exceptional value and benefits to your projects. Trust Texas Instruments for top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and reliability, making it suitable for high temperature environments.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening ensures high reliability and quality of the product, making it ideal for critical applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature conditions without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this product to be used in a wide range of environments, including cold temperatures.

Technology: TTL

TTL technology offers high speed and low power consumption, making this product efficient and reliable for digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNC54AS264J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54AS264J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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