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SNC5482J

Texas Instruments

SNC5482J by Texas Instruments

SNC5482J by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 14 terminals. Operating b/w -55°C to 125°C, it has a nominal voltage of 5V and uses TTL technology. Ideal for military applications requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,206 parts In-Stock

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Digiode

USA . 116 parts In-Stock

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116

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Odintec Ltd.

Israel . 75 parts In-Stock

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75

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Distributors (Availability)

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Andel Nordic

Denmark . 1,358 parts In-Stock

1+ parts

$9.631

100+ parts

-

1k+ parts

$9.245

10k+ parts

$9.245

1,358

$9.631

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$9.245

$9.245

AZTECH Wire

Italy . 460 parts In-Stock

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$10.013

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460

$10.013

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One Stop Electronics

USA . 555 parts In-Stock

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$15.000

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555

$15.000

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Parana Technologies

USA . 150 parts In-Stock

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$22.593

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$23.250

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150

$22.593

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$23.250

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$24.877

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1,329

$24.877

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ChromeModa Solutions

Germany . 4,091 parts In-Stock

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$25.385

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$20.816

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4,091

$25.385

$20.816

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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$25.385

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$24.116

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$22.846

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1,417

$25.385

$24.116

$22.846

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Corphita

USA . 2,836 parts In-Stock

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2,836

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Overview

Elevate your digital arithmetic circuits with the SNC5482J from Texas Instruments. Designed with precision and reliability in mind, this MILITARY-grade component offers unmatched quality and performance. Whether you're working on aerospace applications or military electronics, this product's CERAMIC package body material and MIL-STD-883 Class B screening level ensure durability under extreme conditions. Trust Texas Instruments to deliver cutting-edge technology that meets your needs, providing value, efficiency, and peace of mind with every use.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and mechanical strength, making them suitable for high-temperature and high-reliability applications.

Screening Level: MIL-STD-883 Class B (Modified)

This screening level ensures that the product meets stringent quality and reliability standards, making it suitable for critical military or aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in digital circuits, ensuring compatibility with a wide range of systems and components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the circuit to withstand elevated temperatures, making it suitable for harsh environments.

Technology: TTL

TTL technology offers high-speed operation and excellent noise immunity, making the circuit reliable and efficient in digital applications.

Technical Specifications

Digital Arithmetic Circuits SNC5482J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC5482J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-862-8409, 5962008628409

NIIN

008628409

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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