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SNJ54HC381FK

Texas Instruments

SNJ54HC381FK by Texas Instruments

SNJ54HC381FK by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. With 20 terminals and operating temperatures ranging from -55°C to 125°C, it is suitable for military-grade applications requiring high reliability. This surface-mount device offers quad terminal positioning and meets stringent screening levels like 38535Q/M and 883B.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,528 parts In-Stock

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4,528

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Vyrian

USA . 4,229 parts In-Stock

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4,229

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

1+ parts

$5.041

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726

$5.041

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Parana Technologies

USA . 891 parts In-Stock

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$9.234

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$9.872

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891

$9.234

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$9.872

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DigiPath Technology Company

USA . 25 parts In-Stock

1+ parts

$10.168

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25

$10.168

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ChromeModa Solutions

Germany . 4,335 parts In-Stock

1+ parts

$10.375

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$8.508

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4,335

$10.375

$8.508

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IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$10.375

100+ parts

$9.856

1k+ parts

$9.338

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620

$10.375

$9.856

$9.338

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Andel Nordic

Denmark . 4,271 parts In-Stock

1+ parts

$11.080

100+ parts

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$10.636

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$10.636

4,271

$11.080

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$10.636

$10.636

One Stop Electronics

USA . 250 parts In-Stock

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$18.000

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$18.000

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Corphita

USA . 1,936 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNJ54HC381FK by Texas Instruments. Crafted with precision and reliability in mind, this high-quality chip carrier offers exceptional performance and durability for a variety of applications. From military-grade technology to a wide operating temperature range, this square-shaped package boasts 20 terminals and surface mount capabilities. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Take your projects to the next level with the SNJ54HC381FK.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal performance, making them ideal for high temperature operating environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly, saving time and labor costs during manufacturing.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures reliability and quality, making the product suitable for demanding military or aerospace applications.

Package Shape: SQUARE

The square package shape provides efficient use of board space, allowing for compact and dense circuit designs.

No. of Terminals: 20

Having 20 terminals gives flexibility in connecting to other components and peripherals in the circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good protection for the integrated circuit, making it durable and resistant to external influences.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function in cold environments without any issues.

Terminal Position: QUAD

Quad terminal position provides good stability and ease of connection, ensuring secure and reliable electrical contacts.

Temperature Grade: MILITARY

Being military grade ensures that the product meets strict quality and reliability standards, suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and comply with RoHS regulations, reducing the impact on the environment.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy soldering and assembly, improving the manufacturing process efficiency.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC381FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54HC381FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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