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SN54ALS519FH-00

Texas Instruments

SN54ALS519FH-00 by Texas Instruments

SN54ALS519FH-00 by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 18ns. It operates at a supply voltage range of 4.5V to 5.5V and has open-collector output characteristics, making it suitable for military-grade applications requiring fast data processing in harsh environments. The chip carrier package style with a square shape and ceramic, metal-sealed cofired body material ensures reliable performance in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,908 parts In-Stock

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Vyrian

USA . 2,194 parts In-Stock

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2,194

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Distributors (Availability)

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Andel Nordic

Denmark . 5,567 parts In-Stock

1+ parts

$2.528

100+ parts

-

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$2.427

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$2.427

5,567

$2.528

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$2.427

$2.427

AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$19.102

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349

$19.102

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One Stop Electronics

USA . 881 parts In-Stock

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$20.000

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881

$20.000

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Parana Technologies

USA . 299 parts In-Stock

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$24.608

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$25.270

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299

$24.608

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$25.270

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DigiPath Technology Company

USA . 407 parts In-Stock

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$27.096

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$24.928

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407

$27.096

$24.928

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ChromeModa Solutions

Germany . 6,246 parts In-Stock

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$27.649

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$22.672

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$27.649

$22.672

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$27.649

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$26.267

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$24.884

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1,311

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$24.884

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Corphita

USA . 1,170 parts In-Stock

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Overview

Discover the power of precision and reliability with the SN54ALS519FH-00 from Texas Instruments, a leading manufacturer in digital arithmetic circuits. This cutting-edge product boasts high-quality ceramic, metal-sealed cofired construction and a fast propagation delay of just 18 ns, making it ideal for military-grade applications. With true output polarity and open-collector characteristics, this chip carrier package offers unmatched performance and versatility. Trust Texas Instruments to deliver top-notch technology that exceeds expectations every time. Unlock the potential of your projects with the SN54ALS519FH-00 today!

Feature Benefit Bullets

No. of Bits: 8

Provides sufficient precision for performing arithmetic operations in digital circuits.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage that is commonly used in digital circuits, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 18 ns

Fast operation speed, allowing for quick processing of arithmetic functions.

Output Characteristics: OPEN-COLLECTOR

Flexibility in connecting to external components or circuits due to open-collector output configuration.

Temperature Grade: MILITARY

Designed to withstand harsh environmental conditions, making it suitable for military applications.

Technology: TTL

Uses Transistor-Transistor Logic technology known for high-speed operation and robustness.

Technical Specifications

Digital Arithmetic Circuits SN54ALS519FH-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

ALS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SN54ALS519FH-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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