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SN74AS282FN-00

Texas Instruments

SN74AS282FN-00 by Texas Instruments

SN74AS282FN-00 by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. Operating at 5V, it has a temperature range of 0-70°C and comes in a square chip carrier package. Ideal for commercial applications requiring precise calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,968 parts In-Stock

1+ parts

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1,968

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Digiode

USA . 324 parts In-Stock

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324

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,460 parts In-Stock

1+ parts

$3.575

100+ parts

-

1k+ parts

$3.432

10k+ parts

$3.432

2,460

$3.575

-

$3.432

$3.432

AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$9.918

100+ parts

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489

$9.918

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Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$11.640

100+ parts

-

1k+ parts

$12.035

10k+ parts

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2,358

$11.640

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$12.035

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DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$12.817

100+ parts

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316

$12.817

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ChromeModa Solutions

Germany . 2,926 parts In-Stock

1+ parts

$13.079

100+ parts

$10.725

1k+ parts

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2,926

$13.079

$10.725

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$13.079

100+ parts

$12.425

1k+ parts

$11.771

10k+ parts

-

2,016

$13.079

$12.425

$11.771

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One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$15.000

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471

$15.000

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Corphita

USA . 2,160 parts In-Stock

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2,160

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Overview

Unlock the power of digital arithmetic circuits with the SN74AS282FN-00 by Texas Instruments. Designed with precision and quality in mind, this chip carrier offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this versatile component provides the perfect solution for your electronic needs. Experience the value and benefits that Texas Instruments brings to the table with this innovative product, setting a new standard in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space on the circuit board.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy alignment on the circuit board.

No. of Bits: 4

4-bit digital arithmetic circuits can perform basic arithmetic operations with moderate precision, suitable for many applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies circuit design.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and integration into complex digital systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high reliability, ease of handling, and protection for the internal circuitry.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures stable performance under normal environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this product can function reliably in a wide range of environments.

Terminal Position: QUAD

Quad terminal position simplifies assembly and ensures proper alignment of the circuit within the system.

Maximum Seated Height: 4.57 mm

Compact maximum seated height allows for easy integration into space-constrained designs.

Width: 8.9662 mm

Compact width dimension allows for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V ensures reliable performance even under lower power supply conditions.

Length: 8.9662 mm

Compact length dimension allows for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Technology: TTL

Using TTL technology provides fast switching speeds and compatibility with a wide range of digital systems.

Terminal Form: J BEND

J bend terminal form simplifies soldering and ensures secure connections within the circuit.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm allows for easy integration with standard pitch components on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V provides a safety margin for power supply variations.

Technical Specifications

Digital Arithmetic Circuits SN74AS282FN-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD; WITH ACTIVE HIGH OR LOW SELECTABLE CARRY INPUTS

Family:

AS

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

SN74AS282FN-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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