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SN74HC147NP3

Texas Instruments

SN74HC147NP3 by Texas Instruments

SN74HC147NP3 by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an in-line package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it is ideal for various electronic systems requiring efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,062 parts In-Stock

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7,062

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Digiode

USA . 1,235 parts In-Stock

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1,235

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Distributors (Availability)

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Andel Nordic

Denmark . 5,180 parts In-Stock

1+ parts

$6.507

100+ parts

-

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$6.247

10k+ parts

$6.247

5,180

$6.507

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$6.247

$6.247

Parana Technologies

USA . 2,205 parts In-Stock

1+ parts

$9.072

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$9.731

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2,205

$9.072

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$9.731

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DigiPath Technology Company

USA . 982 parts In-Stock

1+ parts

$9.989

100+ parts

$9.190

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982

$9.989

$9.190

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ChromeModa Solutions

Germany . 2,824 parts In-Stock

1+ parts

$10.193

100+ parts

$8.358

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2,824

$10.193

$8.358

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IDEA Electronic Components Group

UK . 2,060 parts In-Stock

1+ parts

$10.193

100+ parts

$9.683

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$9.174

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2,060

$10.193

$9.683

$9.174

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AZTECH Wire

Italy . 475 parts In-Stock

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$17.657

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475

$17.657

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One Stop Electronics

USA . 623 parts In-Stock

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$49.000

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623

$49.000

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Corphita

USA . 1,317 parts In-Stock

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1,317

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC147NP3 by Texas Instruments. Designed with precision and reliability in mind, this product offers unmatched quality and performance in a variety of industrial applications. With Texas Instruments' reputation for excellence in technology, you can trust that this product will deliver exceptional value and benefits to your projects. Whether you're working on automation, control systems, or data processing, the SN74HC147NP3 is the solution you need for superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for applications where weight and durability are important factors.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing systems and provides a standardized form factor for compatibility with various setups.

Power Supplies (V): 2/6

The product is versatile in terms of power supplies, allowing it to be used in a range of environments and power configurations.

No. of Terminals: 16

With 16 terminals, the product offers ample connectivity options for various input and output connections, providing flexibility in system design.

Package Style (Meter): IN-LINE

The in-line package style makes the product easy to install and integrate into existing setups, saving time and effort during deployment.

Maximum Operating Temperature: 85 °C

The product can operate efficiently in high-temperature environments up to 85°C, making it suitable for industrial applications with demanding thermal requirements.

Minimum Operating Temperature: -40 °C

The product can also withstand low temperatures down to -40°C, ensuring reliable performance in extreme temperature conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved reliability in connections, reducing the risk of signal loss or interruption.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures that the product meets high standards for reliability and performance in harsh industrial environments.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it efficient and reliable for digital arithmetic circuit applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides mechanical stability and ease of soldering during installation, ensuring secure and reliable connections in the circuit.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and precise alignment of the terminals during installation, reducing the risk of misalignment or short circuits.

Technical Specifications

Digital Arithmetic Circuits SN74HC147NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC147NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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