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CD74HC283MTG4

Texas Instruments

CD74HC283MTG4 by Texas Instruments

CD74HC283MTG4 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 315 ns. It operates within a temperature range of -55 to 125 °C and has a supply voltage range of 2-6 V. This CMOS technology device is ideal for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,286 parts In-Stock

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Digiode

USA . 3,475 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Andel Nordic

Denmark . 1,144 parts In-Stock

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$6.181

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-

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$5.934

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$5.934

1,144

$6.181

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$5.934

$5.934

Parana Technologies

USA . 843 parts In-Stock

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$9.209

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$9.850

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DigiPath Technology Company

USA . 448 parts In-Stock

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$10.140

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ChromeModa Solutions

Germany . 6,513 parts In-Stock

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$10.347

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$8.485

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IDEA Electronic Components Group

UK . 461 parts In-Stock

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$10.347

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$9.830

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$9.312

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AZTECH Wire

Italy . 451 parts In-Stock

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Semicontronic

India . 520 parts In-Stock

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$13.000

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$12.675

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Corohmni

South Africa . 143 parts In-Stock

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Ampacity Inc.

Singapore . 1,579 parts In-Stock

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One Stop Electronics

USA . 1,106 parts In-Stock

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Continental Prestige Electronics

USA . 3,687 parts In-Stock

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Advanced Electronics

New Zealand . 3,098 parts In-Stock

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Corphita

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Argo Parts USA

USA . 184 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

USA . 30 parts In-Stock

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$9.091

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Overview

Elevate your digital arithmetic circuits with the CD74HC283MTG4 by Texas Instruments, a product renowned for its high-quality design and reliable performance. Designed with precision and expertise, this versatile component is perfect for a wide range of applications in various industries. With a focus on efficiency and accuracy, this product offers customers unmatched value and benefits. Trust Texas Instruments to provide you with innovative solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging material for the circuit, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, reducing manufacturing time and costs.

No. of Bits: 4

Offers a sufficient and practical number of bits for various arithmetic calculations and operations.

Nominal Supply Voltage / Vsup (V): 4.5

Provides a stable supply voltage for consistent performance of the digital arithmetic circuit.

Propagation Delay (tpd): 315 ns

Ensures fast and efficient operation of the circuit by minimizing delays in signal propagation.

Operating Temperature: -55 to 125 °C

Allows the circuit to function reliably across a wide range of temperatures, suitable for varying environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making the circuit energy-efficient and cost-effective.

Technical Specifications

Digital Arithmetic Circuits CD74HC283MTG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH FULL INTERNAL LOOKAHEAD

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

315 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC283MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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