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SNJ54AC11520FK

Texas Instruments

SNJ54AC11520FK by Texas Instruments

SNJ54AC11520FK by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. Operating temperature range from -55°C to 125°C, with power supplies of 3.3/5V. Ideal for military applications requiring high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,792 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,792

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Digiode

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 980 parts In-Stock

1+ parts

$2.766

100+ parts

-

1k+ parts

$2.655

10k+ parts

$2.655

980

$2.766

-

$2.655

$2.655

AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$14.369

100+ parts

-

1k+ parts

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305

$14.369

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One Stop Electronics

USA . 598 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

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10k+ parts

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598

$19.000

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Parana Technologies

USA . 377 parts In-Stock

1+ parts

$26.700

100+ parts

-

1k+ parts

$27.520

10k+ parts

-

377

$26.700

-

$27.520

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DigiPath Technology Company

USA . 366 parts In-Stock

1+ parts

$29.400

100+ parts

$27.048

1k+ parts

-

10k+ parts

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366

$29.400

$27.048

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ChromeModa Solutions

Germany . 1,580 parts In-Stock

1+ parts

$30.000

100+ parts

$24.600

1k+ parts

-

10k+ parts

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1,580

$30.000

$24.600

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IDEA Electronic Components Group

UK . 555 parts In-Stock

1+ parts

$30.000

100+ parts

$28.500

1k+ parts

$27.000

10k+ parts

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555

$30.000

$28.500

$27.000

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Corphita

USA . 1,638 parts In-Stock

1+ parts

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100+ parts

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1,638

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Overview

Unlock the power of cutting-edge digital arithmetic circuits with the Texas Instruments SNJ54AC11520FK. Crafted with precision and expertise, this high-quality product offers unmatched performance and reliability. Perfect for a wide range of applications, this chip carrier package is designed for military-grade temperature environments. Experience seamless operation with its advanced CMOS technology and enjoy the convenience of no lead terminals. Elevate your projects with the exceptional value and benefits of the SNJ54AC11520FK by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides better thermal resistance and reliability compared to plastic packages, ensuring better performance and durability for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and enhancing the overall design of the product.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure a high level of quality and reliability for the product, meeting military and aerospace industry standards.

Package Shape: SQUARE

Square package shape helps in efficient placement and alignment on circuit boards, optimizing space and improving signal integrity.

Power Supplies (V): 3.3/5

Dual power supply options of 3.3V and 5V provide flexibility in voltage selection based on application requirements, making the product versatile and adaptable.

No. of Terminals: 20

A higher number of terminals allow for more connectivity options and functionality, making the product suitable for complex digital arithmetic circuit applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent thermal performance and protection for the integrated circuits inside, ensuring reliable operation in demanding environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance of 125°C enables the product to perform reliably in harsh operating conditions without risk of overheating.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature rating of -55°C allows the product to function effectively even in extremely cold environments, enhancing its versatility and reliability.

Terminal Position: QUAD

Quad terminal position provides better stability and alignment on the circuit board, reducing the risk of connection issues and improving overall performance.

Temperature Grade: MILITARY

Military-grade temperature grade ensures that the product meets strict standards for reliability and durability, making it suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster operation speeds, making the product efficient and reliable for digital arithmetic circuits.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and offers better environmental sustainability, making the product eco-friendly and compliant with regulations.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for high-density mounting and precise connection, enabling compact and efficient circuit board designs.

Technical Specifications

Digital Arithmetic Circuits SNJ54AC11520FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54AC11520FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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