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CD4063BPWRE4

Texas Instruments

CD4063BPWRE4 by Texas Instruments

CD4063BPWRE4 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 1250 ns. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This CMOS technology chip is ideal for military-grade applications requiring true output polarity in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,024 parts In-Stock

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Digiode

USA . 1,757 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Andel Nordic

Denmark . 1,388 parts In-Stock

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$6.971

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$6.692

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$6.692

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$6.692

AZTECH Wire

Italy . 342 parts In-Stock

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$10.685

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Ampacity Inc.

Singapore . 1,444 parts In-Stock

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$12.000

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Corohmni

South Africa . 119 parts In-Stock

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$17.256

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Parana Technologies

USA . 1,919 parts In-Stock

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$26.293

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$26.893

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DigiPath Technology Company

USA . 1,061 parts In-Stock

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$28.952

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$26.636

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ChromeModa Solutions

Germany . 3,712 parts In-Stock

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$29.543

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$24.225

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

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$29.543

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$28.066

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$26.589

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One Stop Electronics

USA . 1,045 parts In-Stock

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Continental Prestige Electronics

USA . 3,976 parts In-Stock

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Argo Parts USA

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Corphita

USA . 519 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Microchip USA

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Overview

Experience the quality and reliability of Texas Instruments with the CD4063BPWRE4, a versatile digital arithmetic circuit designed to enhance performance in a variety of applications. This innovative product offers customers unmatched value and benefits, with a small outline package that ensures easy integration and a wide operating temperature range for enhanced durability. Whether you're working on military-grade projects or industrial applications, the CD4063BPWRE4 by Texas Instruments is the ideal solution for your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and durability to the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and allows for efficient placement on circuit boards.

No. of Bits: 4

With 4 bits, this product is capable of performing basic arithmetic operations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many electronic systems.

Power Supplies (V): 5/15

This range of power supply options adds flexibility to the product's usage in different environments.

No. of Terminals: 16

Having 16 terminals allows for various connections and functionalities in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package make it suitable for compact designs and efficient use of space.

Propagation Delay (tpd): 1250 ns

The low propagation delay ensures fast processing speed for arithmetic operations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the product to be used in various temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide versatility in connection options for the product.

Maximum Seated Height: 1.2 mm

The low seated height makes the product suitable for compact designs and minimizes space usage on circuit boards.

Width: 4.4 mm

The compact width of the product allows for efficient placement on circuit boards with limited space.

Output Polarity: TRUE

Having true output polarity ensures accurate results in arithmetic calculations.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum voltage of 3V provides flexibility in power supply options for the product.

Length: 5 mm

The compact length of the product contributes to space-saving designs on circuit boards.

Temperature Grade: MILITARY

The military-grade temperature specifications ensure reliability and durability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact design and high-density integration on circuit boards.

Maximum Supply Voltage (Vsup): 18 V

The wide range of maximum supply voltage options adds versatility to the product's compatibility with different systems.

Technical Specifications

Digital Arithmetic Circuits CD4063BPWRE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

1250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD4063BPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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