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SN74HC180FN3

Texas Instruments

SN74HC180FN3 by Texas Instruments

SN74HC180FN3 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in a square chip carrier package. Operating temperature ranges from -40°C to 85°C, making it suitable for industrial applications. This surface-mount device features J bend terminals and is ideal for various electronic systems requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,096 parts In-Stock

1+ parts

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7,096

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Digiode

USA . 2,608 parts In-Stock

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2,608

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Distributors (Availability)

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One Stop Electronics

USA . 339 parts In-Stock

1+ parts

$6.000

100+ parts

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339

$6.000

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Andel Nordic

Denmark . 1,200 parts In-Stock

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$8.022

100+ parts

-

1k+ parts

$7.701

10k+ parts

$7.701

1,200

$8.022

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$7.701

$7.701

AZTECH Wire

Italy . 762 parts In-Stock

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$8.745

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762

$8.745

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Parana Technologies

USA . 1,345 parts In-Stock

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$29.139

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$55.922

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1,345

$29.139

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$55.922

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DigiPath Technology Company

USA . 2,319 parts In-Stock

1+ parts

$32.086

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2,319

$32.086

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ChromeModa Solutions

Germany . 2,102 parts In-Stock

1+ parts

$32.741

100+ parts

$26.848

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2,102

$32.741

$26.848

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IDEA Electronic Components Group

UK . 143 parts In-Stock

1+ parts

$32.741

100+ parts

$31.104

1k+ parts

$29.467

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143

$32.741

$31.104

$29.467

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Corphita

USA . 1,852 parts In-Stock

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1,852

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Overview

Unleash the power of digital arithmetic with the SN74HC180FN3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that guarantee reliability and efficiency. This versatile chip carrier is perfect for a wide range of applications, providing customers with unmatched functionality and performance. Say goodbye to technical headaches and hello to seamless operations with the SN74HC180FN3. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the electronic components, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration onto circuit boards, saving space and improving overall efficiency.

Package Shape: SQUARE

The square shape enables efficient use of space on the circuit board, allowing for more compact designs.

No. of Terminals: 20

Having 20 terminals provides flexibility for connecting to other components, enabling versatile applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style simplifies installation and replacement of the component, reducing maintenance time and effort.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding operational conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position allows for more secure and stable connections, minimizing the risk of signal loss or interference.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and operate reliably in demanding settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable for digital arithmetic circuits.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure soldering onto the circuit board, ensuring a strong and stable connection.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density packaging and precise connections, enhancing the overall performance and functionality of the product.

Technical Specifications

Digital Arithmetic Circuits SN74HC180FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC180FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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