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SN74AS182D3

Texas Instruments

SN74AS182D3 by Texas Instruments

SN74AS182D3 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in a small outline package. It operates b/w 0°C to 70°C, suitable for commercial applications. The surface-mount rectangular package is made of plastic/epoxy, ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,012 parts In-Stock

1+ parts

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8,012

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Digiode

USA . 3,261 parts In-Stock

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3,261

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,921 parts In-Stock

1+ parts

$1.574

100+ parts

-

1k+ parts

$1.511

10k+ parts

$1.511

1,921

$1.574

-

$1.511

$1.511

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$6.199

100+ parts

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429

$6.199

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Parana Technologies

USA . 498 parts In-Stock

1+ parts

$22.570

100+ parts

-

1k+ parts

$23.230

10k+ parts

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498

$22.570

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$23.230

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One Stop Electronics

USA . 841 parts In-Stock

1+ parts

$23.000

100+ parts

-

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841

$23.000

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DigiPath Technology Company

USA . 1,625 parts In-Stock

1+ parts

$24.853

100+ parts

$22.865

1k+ parts

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10k+ parts

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1,625

$24.853

$22.865

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ChromeModa Solutions

Germany . 5,944 parts In-Stock

1+ parts

$25.360

100+ parts

$20.795

1k+ parts

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5,944

$25.360

$20.795

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IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$25.360

100+ parts

$24.092

1k+ parts

$22.824

10k+ parts

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643

$25.360

$24.092

$22.824

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Corphita

USA . 3,777 parts In-Stock

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3,777

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Overview

Elevate your digital arithmetic circuits with the high-quality SN74AS182D3 by Texas Instruments. This innovative product offers reliable performance and precision, backed by the trusted reputation of its manufacturer. Ideal for a variety of applications, this small outline package boasts a dual terminal position and commercial temperature grade, making it versatile and efficient. Experience seamless integration and superior functionality with the SN74AS182D3, unlocking endless possibilities in your projects. Upgrade to Texas Instruments for unparalleled value and benefits in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing overall product size.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and fits well in most standard PCB layouts, improving compatibility.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to other components, enabling versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces the overall footprint of the product, enhancing space efficiency in compact electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even under demanding operating conditions, increasing reliability.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable operation in a wide range of environmental conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal position facilitates easy installation and connection, improving user-friendliness during assembly.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard commercial applications, ensuring compatibility with common electronic systems.

Technology: TTL

TTL technology offers high-speed performance and low power consumption, making the product suitable for applications requiring quick and efficient calculations.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering onto PCBs, enhancing manufacturing efficiency and reliability of connections.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for precise connection and space-saving on the PCB, contributing to a compact overall design.

Technical Specifications

Digital Arithmetic Circuits SN74AS182D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS182D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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