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SN54LS687FK

Texas Instruments

SN54LS687FK by Texas Instruments

SN54LS687FK by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 30ns. It features open-collector outputs, operates in temperatures ranging from -55 to 125°C, and is ideal for military-grade applications requiring fast data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,407 parts In-Stock

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4,407

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Digiode

USA . 3,592 parts In-Stock

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3,592

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Distributors (Availability)

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AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$14.073

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263

$14.073

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Parana Technologies

USA . 1,849 parts In-Stock

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$17.828

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$18.007

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1,849

$17.828

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$18.007

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DigiPath Technology Company

USA . 1,035 parts In-Stock

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$19.630

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$18.060

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1,035

$19.630

$18.060

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ChromeModa Solutions

Germany . 3,207 parts In-Stock

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$20.031

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$16.425

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3,207

$20.031

$16.425

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

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$20.031

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$19.029

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$18.028

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1,158

$20.031

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$18.028

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One Stop Electronics

USA . 1,156 parts In-Stock

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$58.000

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Corphita

USA . 3,550 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the SN54LS687FK from Texas Instruments. Crafted with precision and expertise, this chip carrier package offers reliable performance in military-grade applications. Boasting a nominal supply voltage of 5V and a propagation delay of just 30ns, this high-quality component ensures efficient operation with its inverted output polarity and open-collector characteristics. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and benefits to customers across various industries. Upgrade your digital systems with the SN54LS687FK and experience unparalleled quality and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high durability and reliability, making the product suitable for harsh environments.

No. of Bits: 8

The 8-bit resolution allows for precise and accurate calculations, making this product ideal for applications requiring complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Having a stable supply voltage of 5V ensures consistent performance and reliable operation of the circuit.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for versatile interfacing with other digital circuits, enhancing the product's compatibility and flexibility.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product efficient and suitable for high-speed digital applications.

Technical Specifications

Digital Arithmetic Circuits SN54LS687FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT; WITH A = B & A > B OUTPUTS

Family:

LS

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

SN54LS687FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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