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SN74ALS520NP3

Texas Instruments

SN74ALS520NP3 by Texas Instruments

SN74ALS520NP3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals and a supply voltage of 5V. It operates b/w 0-70°C, making it suitable for commercial applications requiring precise calculations in a rectangular package style. The through-hole terminal form and 2.54mm pitch enhance its durability and ease of integration into electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,080 parts In-Stock

1+ parts

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3,080

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Digiode

USA . 1,573 parts In-Stock

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1,573

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M&R Communications

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,524 parts In-Stock

1+ parts

$11.000

100+ parts

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1,524

$11.000

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Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$11.048

100+ parts

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$11.509

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1,056

$11.048

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$11.509

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DigiPath Technology Company

USA . 953 parts In-Stock

1+ parts

$12.165

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953

$12.165

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ChromeModa Solutions

Germany . 4,999 parts In-Stock

1+ parts

$12.413

100+ parts

$10.179

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4,999

$12.413

$10.179

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$12.413

100+ parts

$11.792

1k+ parts

$11.172

10k+ parts

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1,677

$12.413

$11.792

$11.172

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AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$14.962

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758

$14.962

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Corphita

USA . 144 parts In-Stock

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144

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74ALS520NP3 digital arithmetic circuit. This innovative product offers unparalleled performance and precision, making it ideal for a wide range of applications in the electronics industry. With a focus on value and customer satisfaction, Texas Instruments ensures that this product provides unmatched benefits and advantages to users seeking reliable and efficient solutions for their digital arithmetic needs. Elevate your projects with the SN74ALS520NP3 and discover the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, allowing it to be easily integrated into various electronic assemblies.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that is easy to handle and install, making it compatible with a wide range of circuit designs.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making this product versatile and widely applicable in different electronic systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand relatively high temperatures, ensuring reliable performance in various environmental conditions.

Technology: TTL

Utilizing TTL technology ensures fast and efficient signal processing, making this product suitable for high-speed digital arithmetic circuits requiring quick response times.

Technical Specifications

Digital Arithmetic Circuits SN74ALS520NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS520NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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