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MM74C923M

Texas Instruments

MM74C923M by Texas Instruments

MM74C923M by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 150 ns. It operates at a supply voltage range of 3V to 15V and has an industrial temperature grade. This versatile chip, with 20 terminals in a small outline package, is ideal for applications requiring precise arithmetic calculations in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,204 parts In-Stock

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Vyrian

USA . 3,479 parts In-Stock

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Anansix

USA . 260 parts In-Stock

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260

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LWI Electronics Inc

India . 4 parts In-Stock

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Andel Nordic

Denmark . 3,524 parts In-Stock

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$1.644

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$1.579

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$1.579

3,524

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$1.579

AZTECH Wire

Italy . 469 parts In-Stock

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$7.916

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469

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Parana Technologies

USA . 1,806 parts In-Stock

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$24.667

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$25.336

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DigiPath Technology Company

USA . 2,081 parts In-Stock

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$27.162

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$24.989

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$27.162

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ChromeModa Solutions

Germany . 4,000 parts In-Stock

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$27.716

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$22.727

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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$27.716

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$26.330

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$24.944

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$24.944

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One Stop Electronics

USA . 1,363 parts In-Stock

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$58.000

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Corphita

USA . 3,391 parts In-Stock

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Supply Digital

USA . 2,694 parts In-Stock

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Overview

Discover the innovative MM74C923M by Texas Instruments, a top-quality digital arithmetic circuit that promises unmatched performance and reliability. With a focus on precision engineering and cutting-edge technology, Texas Instruments ensures that this product exceeds industry standards. Ideal for a wide range of applications, this versatile circuit offers customers unparalleled value and benefits. From its compact design to its impressive speed, the MM74C923M is the perfect solution for all your digital arithmetic needs. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to heat and corrosion, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

No. of Bits: 9

Having 9 bits allows for high precision and accuracy in digital computations, making this product suitable for complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of electronic systems and power sources.

No. of Terminals: 20

With 20 terminals, this product offers flexibility in connectivity and integration with other components, enabling versatile use in various applications.

Propagation Delay (tpd): 150 ns

A low propagation delay of 150 ns ensures fast processing and response times, ideal for time-sensitive operations in digital circuits.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C allows this product to function reliably in high-temperature environments, making it suitable for industrial use.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for high impedance when disabled, reducing power consumption and preventing signal interference in interconnected circuits.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions, ensuring reliable performance in harsh environments.

Terminal Position: DUAL

Dual terminal positioning provides redundancy and improved connection stability, enhancing the overall reliability of the product in demanding applications.

Maximum Seated Height: 2.65 mm

A low maximum seated height of 2.65 mm allows for compact and space-saving design, suitable for use in devices with limited vertical clearance.

Width: 7.5 mm

The narrow width of 7.5 mm enables easy integration into tight spaces and compact electronic systems, maximizing efficiency and functionality.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V ensures compatibility with low-power devices and energy-efficient systems, reducing overall power consumption.

Length: 12.8 mm

A compact length of 12.8 mm allows for easy placement and installation in various electronic setups, promoting versatility and space optimization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in rugged conditions and harsh industrial environments, making this product highly durable and suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speeds, making this product efficient and reliable for digital arithmetic circuits.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical support and easy soldering for reliable and stable connections in electronic assemblies.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers precise and standardized connectivity, ensuring compatibility with a wide range of circuit board layouts and designs.

Maximum Supply Voltage (Vsup): 15 V

Capable of operating at a maximum supply voltage of 15V, this product provides flexibility and compatibility with various power sources and electronic systems, accommodating a wide range of applications.

Technical Specifications

Digital Arithmetic Circuits MM74C923M attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

CMOS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

150 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MM74C923M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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