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MM74C922N

Texas Instruments

MM74C922N by Texas Instruments

MM74C922N by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage range of 3V to 15V. It features a propagation delay of 150ns and operates in industrial temperature grades from -40°C to 85°C. This rectangular package is commonly used in applications requiring precise digital calculations and control systems.

Median Price

$5.841

Lifecycle Status

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37

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Nova Conductors

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Forefront Electronics and Design

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Argo Parts USA

USA . 3,944 parts In-Stock

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Continental Prestige Electronics

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Corohmni

South Africa . 253 parts In-Stock

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AZTECH Wire

Italy . 484 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

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Semicontronic

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Parana Technologies

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DigiPath Technology Company

USA . 1,937 parts In-Stock

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ChromeModa Solutions

Germany . 1,487 parts In-Stock

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IDEA Electronic Components Group

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Ampacity Inc.

Singapore . 533 parts In-Stock

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Problanco Electronics

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Supply Digital

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Glotronic Ltd.

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Perfect Parts

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SupplyDigital Components

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Microchip USA

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UHIMA Technologies

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Netroflash

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Overview

Enhance your digital arithmetic circuits with the MM74C922N by Texas Instruments, a top-quality product designed to meet industrial standards. With a package style of IN-LINE and 8 bits of power, this versatile component offers fast propagation delay of 150 ns and 3-STATE output characteristics. From vending machines to gaming consoles, this component is ideal for a wide range of applications. Upgrade your electronics with Texas Instruments' reliable technology, providing customers with value and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the product can withstand various environmental conditions.

No. of Bits: 8

Offers sufficient processing power for handling arithmetic operations effectively.

Nominal Supply Voltage / Vsup (V): 5

Optimal supply voltage for reliable and stable operation of the circuit.

Propagation Delay (tpd): 150 ns

Low propagation delay ensures fast and efficient processing of arithmetic calculations.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Output Characteristics: 3-STATE

Offers flexibility in managing output signals, allowing for tri-state outputs for improved functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits MM74C922N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

CMOS

JESD-30 Code:

R-PDIP-T18

Length:

21.78 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

150 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74C922N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-099-0091, 5962010990091, 5962-01-342-6532, 5962013426532

NIIN

010990091, 013426532

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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