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SN74HC381N3

Texas Instruments

SN74HC381N3 by Texas Instruments

SN74HC381N3 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in an in-line package. It operates b/w -40°C to 85°C, making it suitable for industrial applications. The rectangular plastic/epoxy package shape and through-hole terminal form offer durability and ease of installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,095 parts In-Stock

1+ parts

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5,095

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Digiode

USA . 3,086 parts In-Stock

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3,086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$12.623

100+ parts

-

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229

$12.623

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Parana Technologies

USA . 424 parts In-Stock

1+ parts

$23.802

100+ parts

-

1k+ parts

$24.433

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424

$23.802

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$24.433

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DigiPath Technology Company

USA . 131 parts In-Stock

1+ parts

$26.209

100+ parts

$24.112

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-

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131

$26.209

$24.112

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ChromeModa Solutions

Germany . 4,178 parts In-Stock

1+ parts

$26.744

100+ parts

$21.930

1k+ parts

-

10k+ parts

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4,178

$26.744

$21.930

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IDEA Electronic Components Group

UK . 228 parts In-Stock

1+ parts

$26.744

100+ parts

$25.407

1k+ parts

$24.070

10k+ parts

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228

$26.744

$25.407

$24.070

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One Stop Electronics

USA . 454 parts In-Stock

1+ parts

$34.000

100+ parts

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454

$34.000

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Andel Nordic

Denmark . 1,308 parts In-Stock

1+ parts

$45.737

100+ parts

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$43.907

10k+ parts

$43.907

1,308

$45.737

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$43.907

$43.907

Corphita

USA . 253 parts In-Stock

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253

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC381N3 by Texas Instruments. Manufactured with superior quality and precision, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this innovative technology provides customers with unparalleled value and benefits. Whether you're designing complex mathematical operations or enhancing digital systems, the SN74HC381N3 delivers exceptional results every time. Trust Texas Instruments to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good resistance to heat and moisture, making the product durable and reliable in various operating conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient utilization of space, making it easy to integrate the product into existing systems or designs.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and flexibility in configuring the circuit, catering to a wider range of applications.

Package Style (Meter): IN-LINE

In-line package style is convenient for installation and maintenance, ensuring ease of use and accessibility in different setups.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperatures without compromising performance, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures the product's functionality and reliability in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in the connection, minimizing the risk of signal loss or failure.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product meets the stringent requirements of industrial applications, offering robust performance and durability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and suitable for noise-sensitive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections, ensuring stable operation and ease of soldering during installation.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, the product allows for precise and efficient wiring, facilitating easy integration and maintenance in various setups.

Technical Specifications

Digital Arithmetic Circuits SN74HC381N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC381N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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