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MM74C922WM

Onsemi

MM74C922WM by Onsemi

MM74C922WM by Onsemi is a 9-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 150ns. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has 3-STATE output characteristics. Ideal for applications requiring precise digital calculations in compact electronic devices.

Median Price

$7.877

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Nova Conductors

Japan . 31 parts In-Stock

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Digiode

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Technoshack Inc.

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LWI Electronics Inc

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ComSIT Distribution GmbH

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Ashlea Components Ltd

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Sensible Micro Corp

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Goldney Electronics S.L.

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Mil-Aero Solutions, Inc.

USA . 4 parts In-Stock

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Inland Empire Components Inc.

USA . 4 parts In-Stock

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Sunrise Surplus Inc.

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Bristol Electronics

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Continental Prestige Electronics

USA . 4,625 parts In-Stock

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$7.719

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Netroflash

USA . 2,000 parts In-Stock

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$7.877

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AZTECH Wire

Italy . 211 parts In-Stock

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$9.509

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Semicontronic

India . 629 parts In-Stock

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$21.000

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$20.475

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$20.370

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Aztec Data Supply Inc.

USA . 5,389 parts In-Stock

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$24.940

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Ampacity Inc.

Singapore . 260 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

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SupplyDigital Components

Austria . 6,974 parts In-Stock

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Argo Parts USA

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Problanco Electronics

Mexico . 3,781 parts In-Stock

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Kepictronics

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Lixinc

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Glotronic Ltd.

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Microchip USA

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Corphita

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 432 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Infinite Electronics LLP (Excess)

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Overview

Discover the MM74C922WM by Onsemi, a top-quality digital arithmetic circuit that offers unparalleled performance and reliability. Manufactured by Onsemi, a leader in the industry, this product is designed to meet the highest standards and deliver exceptional results. With applications in various industries, this product provides customers with superior value, benefits, and advantages. Experience seamless operation and maximum efficiency with the MM74C922WM, setting a new standard in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, offering durability and ease of handling.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing overall product size and offering higher component density.

No. of Bits: 9

With a high number of bits, this product can handle complex arithmetic operations effectively, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most system configurations.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient operation and minimal signal distortion, resulting in accurate arithmetic calculations.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and allows for interfacing with other components in the system.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speeds, enhancing the overall performance of the digital arithmetic circuit.

Technical Specifications

Digital Arithmetic Circuits MM74C922WM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Additional Features:

20 KEY ENCODER

Family:

74

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

2.6 mA

Propagation Delay (tpd):

150 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MM74C922WM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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