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SN74LS637JP4

Texas Instruments

SN74LS637JP4 by Texas Instruments

SN74LS637JP4 by Texas Instruments is a 20-terminal TTL digital arithmetic circuit with CERAMIC package. Operating temp range: 0-70°C, suitable for commercial applications. Features RECTANGULAR IN-LINE package style, ideal for through-hole mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,909 parts In-Stock

1+ parts

-

100+ parts

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7,909

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Digiode

USA . 4,580 parts In-Stock

1+ parts

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1k+ parts

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4,580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$6.820

100+ parts

-

1k+ parts

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10k+ parts

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654

$6.820

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One Stop Electronics

USA . 1,167 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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1,167

$22.000

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Parana Technologies

USA . 1,187 parts In-Stock

1+ parts

$25.642

100+ parts

-

1k+ parts

$26.248

10k+ parts

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1,187

$25.642

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$26.248

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DigiPath Technology Company

USA . 230 parts In-Stock

1+ parts

$28.235

100+ parts

-

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10k+ parts

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230

$28.235

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ChromeModa Solutions

Germany . 3,252 parts In-Stock

1+ parts

$28.811

100+ parts

$23.625

1k+ parts

-

10k+ parts

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3,252

$28.811

$23.625

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$28.811

100+ parts

$27.370

1k+ parts

$25.930

10k+ parts

-

1,217

$28.811

$27.370

$25.930

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Andel Nordic

Denmark . 5,832 parts In-Stock

1+ parts

$87.418

100+ parts

-

1k+ parts

$83.921

10k+ parts

$83.921

5,832

$87.418

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$83.921

$83.921

Corphita

USA . 2,560 parts In-Stock

1+ parts

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2,560

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Overview

Unlock the power of digital arithmetic circuits with the SN74LS637JP4 by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unmatched performance and reliability in a variety of applications. Whether you're designing complex computing systems or enhancing digital signal processing, this product delivers exceptional value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Choose the SN74LS637JP4 for superior quality and unparalleled advantages in the world of digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and ensures high reliability under various operating conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easy incorporation into circuit layouts and provides efficient use of space.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount and integrate into existing systems or circuits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably even in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and backup in case one terminal fails, increasing overall product reliability.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is suitable for standard commercial applications.

Technology: TTL

This product uses TTL (Transistor-Transistor Logic) technology, which offers high-speed digital operation and compatibility with many existing systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form makes it easy to solder and mount the product onto a printed circuit board, ensuring secure connections.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm allows for easy connections and compatibility with standard spacing on PCBs.

Technical Specifications

Digital Arithmetic Circuits SN74LS637JP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS637JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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