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SN74HC283D3

Texas Instruments

SN74HC283D3 by Texas Instruments

SN74HC283D3 by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it is ideal for surface mount designs requiring high-speed arithmetic processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,322 parts In-Stock

1+ parts

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4,322

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Vyrian

USA . 3,990 parts In-Stock

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3,990

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,628 parts In-Stock

1+ parts

$7.237

100+ parts

-

1k+ parts

$6.947

10k+ parts

$6.947

1,628

$7.237

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$6.947

$6.947

AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$13.536

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476

$13.536

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Parana Technologies

USA . 129 parts In-Stock

1+ parts

$28.220

100+ parts

$2,620.666

1k+ parts

$25.398

10k+ parts

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129

$28.220

$2,620.666

$25.398

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DigiPath Technology Company

USA . 29 parts In-Stock

1+ parts

$31.074

100+ parts

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29

$31.074

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$31.708

100+ parts

$30.123

1k+ parts

$28.537

10k+ parts

-

2,015

$31.708

$30.123

$28.537

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ChromeModa Solutions

Germany . 1,082 parts In-Stock

1+ parts

$31.708

100+ parts

$26.001

1k+ parts

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1,082

$31.708

$26.001

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One Stop Electronics

USA . 1,210 parts In-Stock

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$55.000

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1,210

$55.000

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Corphita

USA . 4,540 parts In-Stock

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4,540

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Overview

Upgrade your digital arithmetic circuits with the SN74HC283D3 by Texas Instruments. Designed with precision and reliability in mind, this product offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this versatile component is sure to meet your needs. With Texas Instruments' reputation for excellence, you can trust that you are getting a top-quality product that delivers value and efficiency. Take your projects to the next level with the SN74HC283D3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and helps protect the circuits inside the package.

Surface Mount: YES

Surface mount technology makes it easier to integrate the circuit into various electronic devices.

Power Supplies (V): 2/6

Wide range of power supplies (2V to 6V) allows flexibility in usage and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for the circuit to interact with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for more compact designs in electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the circuit to function reliably in colder conditions.

Terminal Position: DUAL

Dual terminal position enables better connectivity and enhances the efficiency of the circuit.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the circuit can withstand harsh industrial environments without degradation in performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the circuit energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections for the circuit, reducing the risk of disconnection.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for precise positioning of the terminals, enhancing the overall reliability of the circuit.

Technical Specifications

Digital Arithmetic Circuits SN74HC283D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC283D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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