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SNJ54HC148FH

Texas Instruments

SNJ54HC148FH by Texas Instruments

SNJ54HC148FH by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. It operates b/w -55°C to 125°C, with power supplies of 2V to 6V. Ideal for military applications requiring high-temperature resistance and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,690 parts In-Stock

1+ parts

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100+ parts

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6,690

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Digiode

USA . 1,734 parts In-Stock

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1,734

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,434 parts In-Stock

1+ parts

$7.564

100+ parts

-

1k+ parts

$7.262

10k+ parts

$7.262

1,434

$7.564

-

$7.262

$7.262

AZTECH Wire

Italy . 348 parts In-Stock

1+ parts

$8.315

100+ parts

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348

$8.315

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Parana Technologies

USA . 575 parts In-Stock

1+ parts

$21.122

100+ parts

-

1k+ parts

$21.388

10k+ parts

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575

$21.122

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$21.388

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DigiPath Technology Company

USA . 635 parts In-Stock

1+ parts

$23.258

100+ parts

$21.398

1k+ parts

-

10k+ parts

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635

$23.258

$21.398

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ChromeModa Solutions

Germany . 2,598 parts In-Stock

1+ parts

$23.733

100+ parts

$19.461

1k+ parts

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10k+ parts

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2,598

$23.733

$19.461

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IDEA Electronic Components Group

UK . 1,936 parts In-Stock

1+ parts

$23.733

100+ parts

$22.546

1k+ parts

$21.360

10k+ parts

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1,936

$23.733

$22.546

$21.360

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One Stop Electronics

USA . 1,126 parts In-Stock

1+ parts

$47.000

100+ parts

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1,126

$47.000

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Corphita

USA . 2,225 parts In-Stock

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2,225

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Overview

Elevate your digital arithmetic circuits with the SNJ54HC148FH from Texas Instruments. Designed with precision and quality in mind, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this chip carrier package boasts a military-grade temperature grade and CMOS technology for optimal functionality. Experience the value and benefits of Texas Instruments' cutting-edge innovation with the SNJ54HC148FH, providing customers with the advantage they need to excel in their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, making it ideal for high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure the reliability and quality of the product, making it suitable for demanding military applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB and facilitates easy placement and routing of signals.

Power Supplies (V): 2/6

Wide range of power supply options allows for flexibility in designing and integrating the product into various systems.

No. of Terminals: 20

Sufficient number of terminals provide ample connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection to the delicate internal components and enables easy handling during installation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature tolerance allows the product to operate reliably in extreme cold environments.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection of the product to the PCB, improving overall system reliability.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product is rugged and reliable for use in mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination, making the product environmentally friendly and compliant with RoHS directives.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for dense packing of terminals on the PCB, saving space and enabling high-speed signal routing.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC148FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54HC148FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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