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SNC54L85J

Texas Instruments

SNC54L85J by Texas Instruments

SNC54L85J by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 14 terminals. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military applications. This TTL technology chip has a ceramic package body and through-hole terminal form.

Median Price

$6.958

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 14 parts In-Stock

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$6.958

100+ parts

$7.306

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$6.888

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$6.958

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Vyrian

USA . 2,566 parts In-Stock

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Digiode

USA . 1,453 parts In-Stock

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Eagle Technology Solutions

USA . 33 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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First Choice Components Inc.

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Distributors (Availability)

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Andel Nordic

Denmark . 3,525 parts In-Stock

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$7.168

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$6.882

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$6.882

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$6.882

AZTECH Wire

Italy . 220 parts In-Stock

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$9.569

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One Stop Electronics

USA . 980 parts In-Stock

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$12.000

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$12.000

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Parana Technologies

USA . 1,495 parts In-Stock

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$20.952

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$21.162

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DigiPath Technology Company

USA . 398 parts In-Stock

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$23.071

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$21.225

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ChromeModa Solutions

Germany . 6,855 parts In-Stock

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$23.542

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$19.304

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IDEA Electronic Components Group

UK . 855 parts In-Stock

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$23.542

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$22.365

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$21.188

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Corphita

USA . 3,694 parts In-Stock

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Perfect Parts

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Overview

Enhance your digital arithmetic circuits with the SNC54L85J by Texas Instruments. Trusted for its quality and precision, Texas Instruments delivers top-of-the-line products to meet all your electronic needs. The SNC54L85J is perfect for applications requiring reliable performance and durability. Upgrade your projects with this military-grade technology that ensures maximum operating efficiency in a variety of conditions. Experience the value and benefits that Texas Instruments brings to the table with the SNC54L85J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent durability and thermal conductivity, making the product rugged and suitable for operation in harsh environments.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening level ensures that the product meets stringent quality and reliability standards, providing confidence in its performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient and compact integration into circuits, optimizing space usage and enhancing overall system design.

No. of Terminals: 14

With 14 terminals, this product offers versatility and connectivity options for various circuit configurations and applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance procedures, facilitating ease of use and reducing assembly complexities.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance under demanding thermal conditions, enhancing the product's durability and longevity.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the product to function effectively in a wide range of temperature environments, increasing its versatility and usability.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, enhancing the product's reliability and performance stability.

Technology: TTL

TTL technology offers fast response times and low power consumption, making the product suitable for high-speed arithmetic calculations and energy-efficient applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies soldering and connection processes, ensuring secure and stable electrical connections for robust circuit performance.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product supports easy integration into standard circuit board layouts, enabling seamless compatibility and hassle-free installation.

Technical Specifications

Digital Arithmetic Circuits SNC54L85J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54L85J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-005-3286, 5962010053286

NIIN

010053286

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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