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SNC54181W

Texas Instruments

SNC54181W by Texas Instruments

SNC54181W by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 24 terminals. Operating b/w -55°C to 125°C, it has a nominal voltage of 5V and uses TTL technology. This rectangular flatpack package is suitable for military applications requiring high reliability and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,975 parts In-Stock

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Digiode

USA . 1,015 parts In-Stock

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1,015

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Distributors (Availability)

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Andel Nordic

Denmark . 3,003 parts In-Stock

1+ parts

$5.528

100+ parts

-

1k+ parts

$5.307

10k+ parts

$5.307

3,003

$5.528

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$5.307

$5.307

AZTECH Wire

Italy . 876 parts In-Stock

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$8.355

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876

$8.355

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

$16.491

100+ parts

$1,531.422

1k+ parts

$14.842

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569

$16.491

$1,531.422

$14.842

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DigiPath Technology Company

USA . 1,582 parts In-Stock

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$18.158

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1,582

$18.158

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ChromeModa Solutions

Germany . 5,774 parts In-Stock

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$18.529

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$15.194

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5,774

$18.529

$15.194

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

1+ parts

$18.529

100+ parts

$17.603

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$16.676

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2,061

$18.529

$17.603

$16.676

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One Stop Electronics

USA . 1,342 parts In-Stock

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$29.000

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Corphita

USA . 1,309 parts In-Stock

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1,309

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Overview

Experience the ultimate in precision and reliability with the Texas Instruments SNC54181W Digital Arithmetic Circuit. Manufactured with top-of-the-line materials and cutting-edge technology, this product is designed to meet MIL-STD-883 Class B standards, ensuring unmatched quality and performance. Perfect for a wide range of applications, this circuit offers customers exceptional value with its durable construction, high efficiency, and versatile functionality. Upgrade your projects with the SNC54181W and discover the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material is known for its excellent thermal properties, making it ideal for high temperature applications. This ensures the durability and reliability of the product under harsh conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making the product suitable for space-constrained applications.

Screening Level: MIL-STD-883 Class B (Modified)

The product adheres to strict military standards for reliability and quality assurance, ensuring its performance in demanding environments.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand elevated temperatures without compromising performance.

Technology: TTL

Uses trusted TTL technology known for its speed and reliability, making it a suitable choice for digital arithmetic circuits where precision and accuracy are key.

Technical Specifications

Digital Arithmetic Circuits SNC54181W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL24,.4

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54181W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-026-6051, 5962010266051

NIIN

010266051

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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