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SNC54278J

Texas Instruments

SNC54278J by Texas Instruments

SNC54278J by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 14 terminals. Operating temperature ranges from -55°C to 125°C, suitable for military applications. Utilizes TTL technology in ceramic package with rectangular shape and through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,567 parts In-Stock

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Digiode

USA . 880 parts In-Stock

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Andel Nordic

Denmark . 1,000 parts In-Stock

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$9.687

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$9.300

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$9.300

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AZTECH Wire

Italy . 497 parts In-Stock

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$15.785

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Parana Technologies

USA . 969 parts In-Stock

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DigiPath Technology Company

USA . 995 parts In-Stock

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ChromeModa Solutions

Germany . 1,488 parts In-Stock

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IDEA Electronic Components Group

UK . 1,244 parts In-Stock

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One Stop Electronics

USA . 1,041 parts In-Stock

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Corphita

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Kepictronics

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Overview

Maximize the efficiency of your digital arithmetic circuits with the SNC54278J from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions that are perfect for military-grade applications. This MIL-STD-883 Class B (Modified) screened product offers unmatched performance in a durable ceramic package, ensuring optimal operation even in extreme temperatures. Upgrade your system with the SNC54278J and experience the value of superior technology and precision engineering.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and mechanical strength, making them ideal for high-temperature and high-reliability applications.

Screening Level: MIL-STD-883 Class B (Modified)

This higher screening level ensures that the product meets stringent military standards for reliability and performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 14

With 14 terminals, this product provides ample connectivity options for various input and output signals.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can perform reliably in demanding environments without overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to operate in extreme cold conditions without performance degradation.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making it suitable for digital arithmetic circuits that require high performance.

Technical Specifications

Digital Arithmetic Circuits SNC54278J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54278J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-078-0608, 5962010780608

NIIN

010780608

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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