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SNC54278W

Texas Instruments

SNC54278W by Texas Instruments

SNC54278W by Texas Instruments is a MIL-STD-883 Class B (Modified) digital arithmetic circuit with 14 terminals. Operating temperature ranges from -55°C to 125°C, suitable for military applications. Utilizes TTL technology in a ceramic flatpack package, making it ideal for harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,714 parts In-Stock

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Digiode

USA . 803 parts In-Stock

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803

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Distributors (Availability)

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Andel Nordic

Denmark . 500 parts In-Stock

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$2.916

100+ parts

-

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$2.799

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$2.799

500

$2.916

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$2.799

$2.799

AZTECH Wire

Italy . 668 parts In-Stock

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$6.538

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$6.538

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Parana Technologies

USA . 156 parts In-Stock

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$7.617

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$8.133

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156

$7.617

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$8.133

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DigiPath Technology Company

USA . 168 parts In-Stock

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$8.387

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$7.716

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168

$8.387

$7.716

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ChromeModa Solutions

Germany . 6,608 parts In-Stock

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$8.558

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$7.018

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$8.558

$7.018

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$8.558

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$8.130

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$7.702

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400

$8.558

$8.130

$7.702

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One Stop Electronics

USA . 1,027 parts In-Stock

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$31.000

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Corphita

USA . 3,531 parts In-Stock

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Overview

Unlock the power of precision and reliability with the SNC54278W from Texas Instruments. As a key player in the digital arithmetic circuits category, Texas Instruments sets the standard for quality and innovation. The SNC54278W offers customers unparalleled value and benefits, with its MIL-STD-883 Class B screening level and military-grade temperature grade ensuring optimal performance in even the harshest conditions. Whether you're looking to enhance your military, aerospace, or industrial applications, the SNC54278W is the perfect choice for achieving top-notch results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent resistance to temperature changes, making it ideal for use in harsh environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit designs, saving space and reducing production costs.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting military standard screening requirements ensures high reliability and performance under demanding conditions.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into circuit layouts and provides efficient use of space.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and supports complex circuit configurations.

Package Style (Meter): FLATPACK

Flatpack design offers a low profile, making it suitable for applications where height restrictions exist.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for demanding industrial and military applications.

Minimum Operating Temperature: -55 °C

Withstands low temperatures, ensuring reliable performance in cold environments.

Terminal Position: DUAL

Dual terminal position allows for increased connectivity options and supports versatile integration.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable operation in extreme temperature conditions.

Technology: TTL

TTL technology offers high-speed data processing and low power consumption, making the product efficient and reliable.

Terminal Form: FLAT

Flat terminal form facilitates easy soldering and connection, simplifying assembly processes.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product allows for high-density circuit designs and precise connections.

Technical Specifications

Digital Arithmetic Circuits SNC54278W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54278W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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