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74HCT688D,653

NXP Semiconductors

74HCT688D,653 by NXP Semiconductors

NXP Semiconductors' 74HCT688D,653 is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 51ns. It is used in automotive applications, featuring a small outline package style and inverted output polarity for efficient performance at temperatures ranging from -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,344 parts In-Stock

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VNN

France . 3,740 parts In-Stock

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Vyrian

USA . 2,240 parts In-Stock

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2,240

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ComSIT Distribution GmbH

Germany . 1,784 parts In-Stock

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ComSIT USA

USA . 1,784 parts In-Stock

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Anansix

USA . 648 parts In-Stock

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648

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Nova Conductors

Japan . 550 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 532 parts In-Stock

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$1.119

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$1.075

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$1.075

532

$1.119

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$1.075

$1.075

Aztec Data Supply Inc.

USA . 4,156 parts In-Stock

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$12.960

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$12.960

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AZTECH Wire

Italy . 238 parts In-Stock

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$14.807

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Corohmni

South Africa . 141 parts In-Stock

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$15.121

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Microchip USA

USA . 439 parts In-Stock

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$15.458

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One Stop Electronics

USA . 1,262 parts In-Stock

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$50.000

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Argo Parts USA

USA . 4,001 parts In-Stock

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Corphita

USA . 3,379 parts In-Stock

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Continental Prestige Electronics

USA . 3,377 parts In-Stock

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UNI Independent Distributors

Spain . 2,053 parts In-Stock

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Perfect Parts

USA . 620 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the high-quality 74HCT688D,653 by NXP Semiconductors. Designed for automotive applications, this product offers a reliable and efficient solution for your electronic needs. With a nominal supply voltage of 5V and a propagation delay of 51 ns, you can trust in the performance and precision of this small outline package. Trust in NXP Semiconductors to deliver cutting-edge technology that meets your circuit needs with ease. Elevate your projects today with the 74HCT688D,653.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides a cost-effective and durable solution for the product.

Surface Mount

YES - This feature allows for easy and efficient PCB assembly.

Package Shape

RECTANGULAR - The shape is standard and fits well in most electronic devices.

No. of Bits

8 - This high number of bits allows for precise and accurate digital arithmetic operations.

Nominal Supply Voltage / Vsup (V)

5 - The 5V supply voltage is a common and widely available power source.

Load Capacitance (CL)

50 pF - The low load capacitance ensures fast and efficient operation.

Power Supplies (V)

5 - The consistent 5V power supply ensures reliable performance.

No. of Terminals

20 - The ample number of terminals allows for versatile connections.

Package Style (Meter)

SMALL OUTLINE - The small outline makes the product compact and space-saving.

Propagation Delay (tpd)

51 ns - The low propagation delay ensures quick processing of arithmetic operations.

Maximum Operating Temperature

125 °C - The high operating temperature range makes this product suitable for various environments.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - The high-quality terminal finish ensures long-term durability.

Terminal Position

DUAL - The dual terminal position allows for flexible mounting options.

Maximum Seated Height

2.65 mm - The low seated height makes the product suitable for compact devices.

Width

7.5 mm - The slim width allows for easy integration into electronic systems.

Output Polarity

INVERTED - The inverted output polarity meets specific circuit requirements.

Minimum Supply Voltage (Vsup)

4.5 V - The low minimum supply voltage ensures flexibility in power sources.

Maximum Time At Peak Reflow Temperature (s)

30 - The short reflow time prevents overheating during assembly.

Peak Reflow Temperature °C

260 - The high peak reflow temperature ensures secure soldering connections.

Length

12.8 mm - The moderate length fits well in standard PCB layouts.

Temperature Grade

AUTOMOTIVE - The automotive-grade temperature rating ensures reliability in harsh environments.

Technology

CMOS - The CMOS technology offers low power consumption and high speed performance.

Terminal Form

GULL WING - The gull wing terminal form provides secure connections.

Terminal Pitch

1.27 mm - The standard terminal pitch allows for easy soldering and assembly.

Maximum Supply Voltage (Vsup)

5.5 V - The high maximum supply voltage provides a safety margin for power fluctuations.

Technical Specifications

Digital Arithmetic Circuits 74HCT688D,653 attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

CASCADABLE

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74HCT688D,653 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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