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74HCT688N

NXP Semiconductors

74HCT688N by NXP Semiconductors

NXP Semiconductors' 74HCT688N is an 8-bit digital arithmetic circuit with a propagation delay of 51ns. Operating b/w -40 to 125 °C, it has a supply voltage range of 4.5V to 5.5V and load capacitance of 50pF. Widely used in automotive applications due to its CMOS technology and inverted output polarity.

Median Price

$1.500

Lifecycle Status

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39

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Nova Conductors

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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Continental Prestige Electronics

USA . 6,454 parts In-Stock

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Argo Parts USA

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Netroflash

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AZTECH Wire

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Overview

Unlock the power of digital arithmetic circuits with the NXP Semiconductors 74HCT688N. Manufactured with precision and expertise, this component offers unparalleled performance and reliability. Ideal for a wide range of applications, from automotive to industrial, this product provides customers with high-quality results and seamless integration. Experience the value and benefits of NXP Semiconductors' innovative technology with the 74HCT688N and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Bits: 8

Offers a high level of precision and accuracy in digital calculations and operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and easily accessible voltage level, making it compatible with a wide range of systems.

Propagation Delay (tpd): 51 ns

Delivers fast processing speeds, reducing latency and improving overall performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding environments.

Minimum Operating Temperature: -40 °C

Operates effectively in cold temperatures, ensuring reliability in various weather conditions.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, improving energy efficiency.

Technical Specifications

Digital Arithmetic Circuits 74HCT688N attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

CASCADABLE

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HCT688N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-360-8808, 5962013608808

NIIN

013608808

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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