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CD74HC85NSR

Texas Instruments

CD74HC85NSR by Texas Instruments

CD74HC85NSR by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 42ns. It operates at a nominal voltage of 4.5V and has a max power supply current of 0.08mA. This CMOS technology chip is ideal for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

$1.139

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$0.380

100+ parts

$0.370

1k+ parts

$0.360

10k+ parts

-

2,000

$0.380

$0.370

$0.360

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Texas Instruments

USA . 107,392 parts In-Stock

1+ parts

$1.008

100+ parts

$0.775

1k+ parts

$0.408

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107,392

$1.008

$0.775

$0.408

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Mouser Electronics

USA . 2,093 parts In-Stock

1+ parts

$1.270

100+ parts

$0.739

1k+ parts

$0.674

10k+ parts

$0.603

2,093

$1.270

$0.739

$0.674

$0.603

DigiKey

USA . 1,397 parts In-Stock

1+ parts

$1.270

100+ parts

$0.738

1k+ parts

$0.673

10k+ parts

$0.592

1,397

$1.270

$0.738

$0.673

$0.592

Distributors (In-Stock)

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Digiode

USA . 107 parts In-Stock

1+ parts

$0.958

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107

$0.958

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Vyrian

USA . 3,989 parts In-Stock

1+ parts

$1.008

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3,989

$1.008

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Semtec, LLC

USA . 2 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,742 parts In-Stock

1+ parts

$0.907

100+ parts

-

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4,742

$0.907

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Native Components

USA . 254 parts In-Stock

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$4.979

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254

$4.979

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Parana Technologies

USA . 387 parts In-Stock

1+ parts

$26.081

100+ parts

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$26.671

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387

$26.081

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$26.671

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DigiPath Technology Company

USA . 1,567 parts In-Stock

1+ parts

$28.718

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1,567

$28.718

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ChromeModa Solutions

Germany . 4,843 parts In-Stock

1+ parts

$29.304

100+ parts

$24.029

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4,843

$29.304

$24.029

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IDEA Electronic Components Group

UK . 2,006 parts In-Stock

1+ parts

$29.304

100+ parts

$27.839

1k+ parts

$26.374

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2,006

$29.304

$27.839

$26.374

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Perfect Parts

USA . 1,026 parts In-Stock

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1,026

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Northwest PG Solutions

USA . 706 parts In-Stock

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$4.880

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706

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$4.880

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Andel Nordic

Denmark . 289 parts In-Stock

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289

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Overview

Upgrade your digital arithmetic circuits with the CD74HC85NSR by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and efficient solutions for a variety of applications. This 4-bit arithmetic comparator offers fast propagation delays and low power consumption, making it ideal for military-grade projects where precision and efficiency are key. With a small outline package and surface mount capabilities, this versatile component provides value and performance that will take your designs to the next level. Trust Texas Instruments to deliver the quality you need for your digital arithmetic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 42 ns

Low propagation delay ensures quick signal processing and high-speed performance.

Surface Mount: YES

Allows for easy installation onto a circuit board, saving space and simplifying the manufacturing process.

No. of Bits: 4

Suitable for applications that require processing and manipulation of 4-bit binary data.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient and stable operation of the circuit.

Load Capacitance (CL): 50 pF

Designed to work with a specific load capacitance for optimal performance.

Power Supplies (V): 2/6

Compatible with a range of power supply voltages, offering flexibility in design and integration.

Maximum I (ol): 5.2 Amp

Can handle high output currents, making it suitable for applications that require driving significant loads.

Maximum Operating Temperature: 125 °C

Capable of functioning in high-temperature environments, ideal for industrial and military applications.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable electrical connections.

Technology: CMOS

Uses CMOS technology, known for low power consumption and high noise immunity.

Technical Specifications

Digital Arithmetic Circuits CD74HC85NSR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE, THREE POSSIBLE OUTPUTS ARE AB

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

295 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

CD74HC85NSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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