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SN54ALS677JT

Texas Instruments

SN54ALS677JT by Texas Instruments

SN54ALS677JT by Texas Instruments is a 24-terminal digital arithmetic circuit in ceramic package. Operating temp range -55 to 125°C, MIL grade, TTL technology. Ideal for military applications requiring high-performance arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,679 parts In-Stock

1+ parts

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7,679

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Digiode

USA . 4,311 parts In-Stock

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4,311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,597 parts In-Stock

1+ parts

$6.382

100+ parts

-

1k+ parts

$6.127

10k+ parts

$6.127

2,597

$6.382

-

$6.127

$6.127

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$10.938

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747

$10.938

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Parana Technologies

USA . 1,157 parts In-Stock

1+ parts

$23.528

100+ parts

-

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$24.161

10k+ parts

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1,157

$23.528

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$24.161

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DigiPath Technology Company

USA . 1,138 parts In-Stock

1+ parts

$25.907

100+ parts

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1,138

$25.907

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ChromeModa Solutions

Germany . 4,894 parts In-Stock

1+ parts

$26.436

100+ parts

$21.678

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4,894

$26.436

$21.678

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

1+ parts

$26.436

100+ parts

$25.114

1k+ parts

$23.792

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2,212

$26.436

$25.114

$23.792

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One Stop Electronics

USA . 1,290 parts In-Stock

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$42.000

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1,290

$42.000

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Corphita

USA . 4,521 parts In-Stock

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4,521

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Overview

Elevate your digital arithmetic circuits with the high-quality SN54ALS677JT by Texas Instruments. Built with precision and reliability in mind, this product offers unmatched performance for a wide range of applications. From military-grade technology to a durable ceramic package, this device ensures optimal functionality even in extreme temperatures. Trust Texas Instruments to deliver top-of-the-line solutions that provide lasting value and efficiency for all your circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and resistance to high temperatures, making it an ideal choice for electronic circuits that may be subjected to harsh conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit boards and provides a compact design for space-saving applications.

No. of Terminals: 24

Having 24 terminals allows for a greater degree of connectivity and flexibility in circuit design, accommodating a variety of input and output signals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, suitable for demanding industrial environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function reliably in cold conditions, making it versatile for use in various climates.

Temperature Grade: MILITARY

Military-grade components are designed to meet stringent reliability and performance standards, ensuring long-term functionality in critical applications.

Technology: TTL

Transistor-Transistor Logic (TTL) technology offers high-speed performance and low power consumption, making the product efficient and reliable for digital arithmetic operations.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and easy soldering for robust circuit assembly, enhancing the product's durability and reliability.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures compatibility with commonly used connectors and facilitates easy integration into circuit layouts, simplifying installation and maintenance.

Technical Specifications

Digital Arithmetic Circuits SN54ALS677JT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54ALS677JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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