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SN54S182W

Texas Instruments

SN54S182W by Texas Instruments

SN54S182W by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 10.5 ns, suitable for military-grade applications. It operates within a temperature range of -55 to 125 °C and has a max power supply current of 99 mA. The package style is flatpack, making it ideal for surface mount applications in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,845 parts In-Stock

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2,845

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Vyrian

USA . 2,396 parts In-Stock

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2,396

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Electronic Expediters

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$5.297

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692

$5.297

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Andel Nordic

Denmark . 636 parts In-Stock

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$7.514

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$7.213

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$7.213

636

$7.514

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$7.213

$7.213

Parana Technologies

USA . 776 parts In-Stock

1+ parts

$20.806

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$20.965

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776

$20.806

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$20.965

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DigiPath Technology Company

USA . 1,458 parts In-Stock

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$22.910

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1,458

$22.910

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ChromeModa Solutions

Germany . 2,262 parts In-Stock

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$23.378

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$19.170

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$23.378

$19.170

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IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$23.378

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$22.209

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$21.040

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2,250

$23.378

$22.209

$21.040

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One Stop Electronics

USA . 974 parts In-Stock

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$32.000

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974

$32.000

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Corphita

USA . 4,479 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SN54S182W from Texas Instruments, a product known for its high-quality manufacturing and reliable performance. Ideal for a wide range of applications, this component offers customers unmatched value and benefits. Experience faster processing speeds and improved efficiency without sacrificing durability or precision. Trust in Texas Instruments to deliver top-of-the-line solutions for all your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for rugged environments.

No. of Bits: 4

This product offers 4 bits of digital arithmetic capability, which can handle various mathematical operations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with many digital systems and power sources.

Propagation Delay (tpd): 10.5 ns

With a low propagation delay, this product can process calculations quickly, making it ideal for time-sensitive applications.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, this product is suitable for military or aerospace applications where reliability is crucial.

Technical Specifications

Digital Arithmetic Circuits SN54S182W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD

Family:

S

JESD-30 Code:

R-CDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SN54S182W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-022-2201, 5962010222201

NIIN

010222201

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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