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SNJ54AC11280J

Texas Instruments

SNJ54AC11280J by Texas Instruments

SNJ54AC11280J by Texas Instruments is a CMOS digital arithmetic circuit with 14 terminals, operating at temperatures from -55°C to 125°C. It has power supplies of 3.3/5V and is MILITARY grade suitable for applications requiring high reliability in harsh environments. The package style is IN-LINE, making it ideal for military and aerospace industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,648 parts In-Stock

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Digiode

USA . 3,448 parts In-Stock

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Andel Nordic

Denmark . 2,259 parts In-Stock

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$6.515

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$6.255

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$6.255

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$6.255

Parana Technologies

USA . 1,417 parts In-Stock

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$9.077

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$9.735

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$9.077

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DigiPath Technology Company

USA . 644 parts In-Stock

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$9.995

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$9.195

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644

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$9.195

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ChromeModa Solutions

Germany . 2,236 parts In-Stock

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$10.199

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$8.363

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$10.199

$8.363

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IDEA Electronic Components Group

UK . 101 parts In-Stock

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$10.199

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$9.689

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$9.179

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101

$10.199

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$9.179

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AZTECH Wire

Italy . 581 parts In-Stock

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$10.267

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One Stop Electronics

USA . 1,193 parts In-Stock

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$29.000

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Corphita

USA . 2,513 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SNJ54AC11280J, a cutting-edge digital arithmetic circuit designed for high-performance applications. This innovative product offers customers unparalleled value and benefits, providing them with a seamless and efficient solution for their electronic needs. Whether you're in need of precision calculations or advanced data processing, the SNJ54AC11280J is the perfect choice to elevate your projects to the next level. Trust in Texas Instruments to deliver top-notch technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and durability, making them suitable for military-grade applications.

Screening Level: 38535Q/M;38534H;883B

These screening levels ensure high reliability and quality, important for critical military operations.

Power Supplies (V): 3.3/5

The ability to operate at multiple power supply voltages adds versatility to the product's applications.

No. of Terminals: 14

Sufficient number of terminals for connecting various components and facilitating ease of integration.

Package Style (Meter): IN-LINE

The in-line package style allows for compact and efficient placement on a circuit board.

Maximum Operating Temperature: 125 °C

Capable of withstanding high operating temperatures, ideal for demanding environments.

Minimum Operating Temperature: -55 °C

Offers a wide temperature range for operation in extreme cold conditions as well.

Temperature Grade: MILITARY

Designed to meet stringent military standards for reliability and performance in harsh environments.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust connections and easy soldering for rugged applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch size for compatibility with widely used components and circuit boards.

Technical Specifications

Digital Arithmetic Circuits SNJ54AC11280J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54AC11280J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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