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SNJ54ACT11280FK

Texas Instruments

SNJ54ACT11280FK by Texas Instruments

SNJ54ACT11280FK by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in a square chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. With a nominal voltage of 5V, it is ideal for high-reliability systems requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,975 parts In-Stock

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7,975

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Digiode

USA . 2,837 parts In-Stock

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2,837

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Distributors (Availability)

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Andel Nordic

Denmark . 51 parts In-Stock

1+ parts

$3.122

100+ parts

-

1k+ parts

$2.997

10k+ parts

$2.997

51

$3.122

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$2.997

$2.997

Parana Technologies

USA . 1,883 parts In-Stock

1+ parts

$12.504

100+ parts

-

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$12.943

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1,883

$12.504

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$12.943

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DigiPath Technology Company

USA . 1,298 parts In-Stock

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$13.768

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1,298

$13.768

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One Stop Electronics

USA . 981 parts In-Stock

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$14.000

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981

$14.000

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ChromeModa Solutions

Germany . 2,237 parts In-Stock

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$14.049

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$11.520

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2,237

$14.049

$11.520

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

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$14.049

100+ parts

$13.347

1k+ parts

$12.644

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1,886

$14.049

$13.347

$12.644

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AZTECH Wire

Italy . 500 parts In-Stock

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$18.429

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$18.429

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Corphita

USA . 3,831 parts In-Stock

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3,831

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Overview

Elevate your digital arithmetic circuits with the high-quality SNJ54ACT11280FK by Texas Instruments. Designed for military-grade applications, this chip carrier package offers superior performance and reliability. With a nominal supply voltage of 5V, this square-shaped ceramic package is perfect for a wide range of electronic devices. Trust in Texas Instruments to deliver cutting-edge technology that meets the demands of the most challenging environments. Upgrade your circuit designs with the SNJ54ACT11280FK and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and stability, making it ideal for high-temperature and harsh environments.

Surface Mount: YES

Surface mount technology allows for easy installation and integration onto circuit boards, saving space and reducing assembly time.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures reliability and quality in performance, meeting military standards for critical applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most systems and simplifies power management.

Maximum Operating Temperature: 125 °C

Capability to operate at high temperatures up to 125°C allows for reliable performance in demanding conditions without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and robust signal processing capabilities.

Technical Specifications

Digital Arithmetic Circuits SNJ54ACT11280FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54ACT11280FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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