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SN74L85N1

Texas Instruments

SN74L85N1 by Texas Instruments

SN74L85N1 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations and logic operations. The through-hole terminal form and 2.54mm pitch enhance its ease of use in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,375 parts In-Stock

1+ parts

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100+ parts

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7,375

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Digiode

USA . 1,994 parts In-Stock

1+ parts

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1,994

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$15.872

100+ parts

-

1k+ parts

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647

$15.872

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Parana Technologies

USA . 887 parts In-Stock

1+ parts

$25.753

100+ parts

-

1k+ parts

$26.357

10k+ parts

-

887

$25.753

-

$26.357

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DigiPath Technology Company

USA . 1,256 parts In-Stock

1+ parts

$28.357

100+ parts

-

1k+ parts

-

10k+ parts

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1,256

$28.357

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ChromeModa Solutions

Germany . 1,009 parts In-Stock

1+ parts

$28.936

100+ parts

$23.728

1k+ parts

-

10k+ parts

-

1,009

$28.936

$23.728

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IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$28.936

100+ parts

$27.489

1k+ parts

$26.042

10k+ parts

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318

$28.936

$27.489

$26.042

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Andel Nordic

Denmark . 603 parts In-Stock

1+ parts

$29.276

100+ parts

-

1k+ parts

$28.105

10k+ parts

$28.105

603

$29.276

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$28.105

$28.105

One Stop Electronics

USA . 671 parts In-Stock

1+ parts

$43.000

100+ parts

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671

$43.000

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Corphita

USA . 2,276 parts In-Stock

1+ parts

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2,276

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Overview

Discover the power of precision with the SN74L85N1 by Texas Instruments. As a leading manufacturer in digital arithmetic circuits, Texas Instruments guarantees top-notch quality and reliability. This versatile component is perfect for a wide range of applications, offering efficient performance and seamless integration. Experience the value and benefits of this product, designed to exceed your expectations and elevate your projects to new heights. Choose Texas Instruments for superior technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective for mass production.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration and placement into electronic circuits and systems.

No. of Terminals: 14

Having 14 terminals allows for a sufficient number of connections for various arithmetic operations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can handle demanding working conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the device to other components or circuits.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring compatibility with standard operating environments.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product efficient for arithmetic operations.

Terminal Form: THROUGH-HOLE

Through-hole terminals are sturdy and reliable, simplifying the assembly process and ensuring secure connections.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection to standard prototyping boards and circuits.

Technical Specifications

Digital Arithmetic Circuits SN74L85N1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74L85N1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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