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SN74LS683DW3

Texas Instruments

SN74LS683DW3 by Texas Instruments

SN74LS683DW3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at 5V. It features a rectangular package shape, gull wing terminal form, and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise arithmetic calculations in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,423 parts In-Stock

1+ parts

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6,423

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Digiode

USA . 1,983 parts In-Stock

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1,983

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,756 parts In-Stock

1+ parts

$9.488

100+ parts

-

1k+ parts

$10.094

10k+ parts

-

1,756

$9.488

-

$10.094

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$9.872

100+ parts

-

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252

$9.872

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$10.448

100+ parts

-

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2,004

$10.448

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ChromeModa Solutions

Germany . 1,451 parts In-Stock

1+ parts

$10.661

100+ parts

$8.742

1k+ parts

-

10k+ parts

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1,451

$10.661

$8.742

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IDEA Electronic Components Group

UK . 591 parts In-Stock

1+ parts

$10.661

100+ parts

$10.128

1k+ parts

$9.595

10k+ parts

-

591

$10.661

$10.128

$9.595

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Andel Nordic

Denmark . 5,831 parts In-Stock

1+ parts

$26.376

100+ parts

-

1k+ parts

$25.321

10k+ parts

$25.321

5,831

$26.376

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$25.321

$25.321

One Stop Electronics

USA . 1,387 parts In-Stock

1+ parts

$44.000

100+ parts

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1,387

$44.000

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Corphita

USA . 3,077 parts In-Stock

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3,077

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Overview

Upgrade your digital arithmetic circuits with the SN74LS683DW3 by Texas Instruments. Manufactured with precision and quality, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this component delivers exceptional value and benefits to customers looking for efficient and effective solutions. Trust in Texas Instruments to provide you with the best in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protects the internal components of the product, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling high density layouts.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and makes it easy to integrate the product into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power supplies and simplifies the design of the overall system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand extended use in various environmental conditions.

Technology: TTL

Using TTL technology provides fast switching speeds and low power consumption, making the product suitable for high-performance applications.

Technical Specifications

Digital Arithmetic Circuits SN74LS683DW3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS683DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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