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SNJ54LS283FK

Texas Instruments

SNJ54LS283FK by Texas Instruments

SNJ54LS283FK by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 24 ns at 5V. It features inverted output polarity, operates in military temperature grade range (-55 to 125 °C), and has a max power supply current of 39 mA. This chip carrier package is suitable for applications requiring fast arithmetic operations in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,558 parts In-Stock

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Vyrian

USA . 3,264 parts In-Stock

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3,264

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Resion

USA . 39 parts In-Stock

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39

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Mentor Electronics Marketing, LLC

USA . 15 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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One Stop Electronics

USA . 437 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 698 parts In-Stock

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$5.345

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Andel Nordic

Denmark . 3,337 parts In-Stock

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$8.796

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$8.444

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$8.444

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$8.796

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$8.444

Parana Technologies

USA . 2,033 parts In-Stock

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$9.988

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$927.581

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$8.990

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2,033

$9.988

$927.581

$8.990

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DigiPath Technology Company

USA . 740 parts In-Stock

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$10.999

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$10.119

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740

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ChromeModa Solutions

Germany . 2,422 parts In-Stock

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$11.223

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$9.203

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IDEA Electronic Components Group

UK . 326 parts In-Stock

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$11.223

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$10.662

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$10.101

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$29.915

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$27.223

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$24.530

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Microchip USA

USA . 2,827 parts In-Stock

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Corphita

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Overview

Enhance your digital arithmetic circuits with the SNJ54LS283FK by Texas Instruments, a high-quality product designed to deliver exceptional performance and reliability. Manufactured by the trusted brand, this chip carrier package boasts a MILITARY grade screening level and a wide temperature range, making it suitable for a variety of applications. With fast propagation delay and inverted output polarity, this component ensures precise and efficient calculations. Invest in the SNJ54LS283FK today to experience superior functionality and unmatched value in your electronic projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh operating conditions.

Propagation Delay At Nominal Supply: 24 ns

Low propagation delay allows for fast processing speeds in digital arithmetic operations.

No. of Bits: 4

With 4 bits, this circuit can handle a moderate range of arithmetic calculations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this product compatible with common power sources.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows for usage in various environments without compromising performance.

Technology: TTL

TTL technology offers high speed and low power consumption, enhancing the overall efficiency of the arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS283FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54LS283FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-272-8018, 5962012728018

NIIN

012728018

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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