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SN74LS681NP3

Texas Instruments

SN74LS681NP3 by Texas Instruments

SN74LS681NP3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations and logic operations. The through-hole terminal form and 2.54mm pitch enhance its reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,491 parts In-Stock

1+ parts

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4,491

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Vyrian

USA . 2,009 parts In-Stock

1+ parts

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2,009

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,354 parts In-Stock

1+ parts

$2.457

100+ parts

-

1k+ parts

$2.359

10k+ parts

$2.359

5,354

$2.457

-

$2.359

$2.359

AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$15.028

100+ parts

-

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316

$15.028

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Parana Technologies

USA . 1,448 parts In-Stock

1+ parts

$26.696

100+ parts

-

1k+ parts

$27.459

10k+ parts

-

1,448

$26.696

-

$27.459

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DigiPath Technology Company

USA . 1,383 parts In-Stock

1+ parts

$29.396

100+ parts

$27.044

1k+ parts

-

10k+ parts

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1,383

$29.396

$27.044

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ChromeModa Solutions

Germany . 3,492 parts In-Stock

1+ parts

$29.996

100+ parts

$24.597

1k+ parts

-

10k+ parts

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3,492

$29.996

$24.597

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

1+ parts

$29.996

100+ parts

$28.496

1k+ parts

$26.996

10k+ parts

-

1,735

$29.996

$28.496

$26.996

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One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$63.000

100+ parts

-

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519

$63.000

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Corphita

USA . 413 parts In-Stock

1+ parts

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413

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Overview

Elevate your digital arithmetic circuits with the SN74LS681NP3 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers reliable solutions for a wide range of applications. This versatile component offers unparalleled value and benefits to customers, providing seamless integration and enhanced performance. Upgrade your projects with the SN74LS681NP3 and experience the advantages of Texas Instruments' expertise in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the circuit, making it suitable for various environments.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this circuit into different systems and setups efficiently.

No. of Terminals: 20

Having a sufficient number of terminals allows for more flexibility in connecting the circuit to other components or systems.

Package Style (Meter): IN-LINE

The in-line package style ensures easy installation and maintenance of the circuit in a streamlined manner.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows this circuit to function effectively in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this circuit can operate reliably even in colder conditions.

Terminal Position: DUAL

The dual terminal position enables more secure and stable connections for the circuit, reducing the risk of loose connections.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this circuit is suitable for standard commercial applications.

Technology: TTL

TTL technology ensures fast and reliable digital signal processing, making this circuit ideal for arithmetic calculations and operations.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a reliable and sturdy connection for the circuit on the PCB, enhancing its overall durability.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy integration of this circuit into existing systems or circuit boards with compatible spacing.

Technical Specifications

Digital Arithmetic Circuits SN74LS681NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS681NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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