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SNJ54ALS29809FK

Texas Instruments

SNJ54ALS29809FK by Texas Instruments

SNJ54ALS29809FK by Texas Instruments is a 9-bit digital arithmetic circuit with inverted output polarity. It operates on a supply voltage range of 4.5V to 5.5V and has a propagation delay of 13ns. This MILITARY-grade chip carrier package is ideal for applications requiring fast arithmetic calculations in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,164 parts In-Stock

1+ parts

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8,164

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Digiode

USA . 1,113 parts In-Stock

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1,113

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Distributors (Availability)

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Andel Nordic

Denmark . 212 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

$3.864

10k+ parts

$3.864

212

$4.025

-

$3.864

$3.864

AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$6.842

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624

$6.842

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Parana Technologies

USA . 870 parts In-Stock

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$24.317

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$24.977

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870

$24.317

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$24.977

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DigiPath Technology Company

USA . 1,916 parts In-Stock

1+ parts

$26.776

100+ parts

$24.634

1k+ parts

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1,916

$26.776

$24.634

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ChromeModa Solutions

Germany . 3,451 parts In-Stock

1+ parts

$27.322

100+ parts

$22.404

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3,451

$27.322

$22.404

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IDEA Electronic Components Group

UK . 304 parts In-Stock

1+ parts

$27.322

100+ parts

$25.956

1k+ parts

$24.590

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304

$27.322

$25.956

$24.590

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One Stop Electronics

USA . 1,141 parts In-Stock

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$31.000

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$31.000

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Corphita

USA . 655 parts In-Stock

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655

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Overview

Upgrade your digital arithmetic circuits with the SNJ54ALS29809FK by Texas Instruments. Known for their top-quality components and innovative technology, Texas Instruments delivers reliable solutions for a wide range of applications. With a package body material of ceramic and metal-sealed cofired, this chip carrier style device offers 9 bits of precision with fast propagation delay of just 13 ns. Ideal for military-grade operations, this product boasts a wide operating temperature range from -55 to 125°C. Trust Texas Instruments to provide you with superior performance and unmatched value in every circuit.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Ease of installation and compact design for space-saving in circuit board layout.

No. of Bits: 9

Offers high precision and accuracy in digital calculations.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supply voltage, ensuring easy integration into existing systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and efficient heat dissipation for the components.

Propagation Delay (tpd): 13 ns

Fast processing speed for quick response times in digital arithmetic operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and military applications.

Technology: TTL

Utilizes TTL technology known for its high speed and low power consumption, enhancing overall performance.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS29809FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE; OPEN COLLECTOR ACK OUTPUT WITH A CONTROL; WITH PULL-UP RESISTORS ON B INPUTS

Family:

ALS

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

SNJ54ALS29809FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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