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SN74ALS677FN3

Texas Instruments

SN74ALS677FN3 by Texas Instruments

SN74ALS677FN3 by Texas Instruments is a TTL digital arithmetic circuit in a 28-terminal chip carrier package. Operating temperature range of 0-70°C, suitable for commercial applications. Features J bend terminals and quad terminal position, ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,363 parts In-Stock

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5,363

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Digiode

USA . 2,370 parts In-Stock

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2,370

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,479 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

$2.557

10k+ parts

$2.557

1,479

$2.664

-

$2.557

$2.557

AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$8.266

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725

$8.266

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Parana Technologies

USA . 1,280 parts In-Stock

1+ parts

$14.915

100+ parts

$1,385.049

1k+ parts

$13.423

10k+ parts

-

1,280

$14.915

$1,385.049

$13.423

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DigiPath Technology Company

USA . 2,338 parts In-Stock

1+ parts

$16.423

100+ parts

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2,338

$16.423

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ChromeModa Solutions

Germany . 3,071 parts In-Stock

1+ parts

$16.758

100+ parts

$13.742

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-

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3,071

$16.758

$13.742

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IDEA Electronic Components Group

UK . 2,118 parts In-Stock

1+ parts

$16.758

100+ parts

$15.920

1k+ parts

$15.082

10k+ parts

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2,118

$16.758

$15.920

$15.082

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One Stop Electronics

USA . 925 parts In-Stock

1+ parts

$29.000

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925

$29.000

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Corphita

USA . 1,418 parts In-Stock

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1,418

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Overview

Unlock the power of digital arithmetic circuits with the SN74ALS677FN3 by Texas Instruments. Manufactured with precision and expertise, this high-quality chip carrier offers exceptional performance in a variety of applications. From data processing to signal manipulation, this versatile component provides customers with unmatched value and reliability. Experience seamless integration and superior functionality with Texas Instruments' cutting-edge technology. Elevate your projects with the SN74ALS677FN3 and discover the endless possibilities it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which is ideal for electronic components.

Surface Mount: YES

Easy to install and mount on circuit boards, saving time and effort.

Package Shape: SQUARE

Compact shape that allows for efficient use of space on a circuit board.

No. of Terminals: 28

Sufficient number of terminals for connecting various components and signals.

Package Style (Meter): CHIP CARRIER

Modern and reliable packaging style for integrated circuits that ensures protection and connectivity.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: 0 °C

Can operate in low temperature conditions without any issues.

Terminal Position: QUAD

Allows for easy connectivity and arrangement of components in a circuit.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications and environments.

Technology: TTL

Uses Transistor-Transistor Logic technology which is well-established and reliable for digital circuits.

Terminal Form: J BEND

J Bend terminals are robust and provide a secure connection in electronic assemblies.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy soldering and connection to other components.

Technical Specifications

Digital Arithmetic Circuits SN74ALS677FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74ALS677FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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