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SN74278JP4

Texas Instruments

SN74278JP4 by Texas Instruments

SN74278JP4 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, suitable for commercial applications. With dual terminal position and through-hole technology, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,532 parts In-Stock

1+ parts

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6,532

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Digiode

USA . 657 parts In-Stock

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657

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,989 parts In-Stock

1+ parts

$5.270

100+ parts

-

1k+ parts

$5.059

10k+ parts

$5.059

3,989

$5.270

-

$5.059

$5.059

AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$15.339

100+ parts

-

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619

$15.339

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Parana Technologies

USA . 42 parts In-Stock

1+ parts

$25.692

100+ parts

-

1k+ parts

$26.292

10k+ parts

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42

$25.692

-

$26.292

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One Stop Electronics

USA . 442 parts In-Stock

1+ parts

$27.000

100+ parts

-

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442

$27.000

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DigiPath Technology Company

USA . 1,478 parts In-Stock

1+ parts

$28.290

100+ parts

$26.026

1k+ parts

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10k+ parts

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1,478

$28.290

$26.026

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ChromeModa Solutions

Germany . 2,870 parts In-Stock

1+ parts

$28.867

100+ parts

$23.671

1k+ parts

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10k+ parts

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2,870

$28.867

$23.671

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IDEA Electronic Components Group

UK . 758 parts In-Stock

1+ parts

$28.867

100+ parts

$27.424

1k+ parts

$25.980

10k+ parts

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758

$28.867

$27.424

$25.980

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Corphita

USA . 4,655 parts In-Stock

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4,655

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Overview

Elevate your digital arithmetic circuits with the SN74278JP4 from Texas Instruments. Known for their superior quality and innovation, Texas Instruments brings you a product that offers unmatched reliability and performance. Ideal for a wide range of applications, this product is designed to meet your needs with precision and efficiency. With its advanced technology and commercial-grade temperature tolerance, the SN74278JP4 provides exceptional value and benefits for all your circuitry requirements. Experience the advantages of Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, allowing for efficient heat dissipation and maintaining stable operation at high temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and minimizes the overall footprint of the product.

No. of Terminals: 14

With 14 terminals, this product offers ample connection points for interfacing with other components or circuits.

Package Style (Meter): IN-LINE

The in-line package style makes this product suitable for applications where space is limited and components need to be arranged in a linear fashion.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance even in environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this product can function effectively in a wide range of ambient conditions.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product is suitable for use in standard industrial environments.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product ideal for high-speed digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals are robust and provide a strong mechanical connection, enhancing the reliability of the product.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for easy soldering and connection to PCBs, simplifying the assembly process.

Technical Specifications

Digital Arithmetic Circuits SN74278JP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74278JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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