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SNJ54ALS518FH

Texas Instruments

SNJ54ALS518FH by Texas Instruments

SNJ54ALS518FH by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at temperatures from -55 to 125°C. It has a supply voltage of 5V and is suitable for military applications due to its MIL-STD screening levels. This chip carrier package with ceramic body material is surface mountable and ideal for high-reliability electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,723 parts In-Stock

1+ parts

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3,723

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Digiode

USA . 1,383 parts In-Stock

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1,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 497 parts In-Stock

1+ parts

$6.096

100+ parts

-

1k+ parts

$5.852

10k+ parts

$5.852

497

$6.096

-

$5.852

$5.852

Parana Technologies

USA . 2,199 parts In-Stock

1+ parts

$9.276

100+ parts

-

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$9.908

10k+ parts

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2,199

$9.276

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$9.908

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ChromeModa Solutions

Germany . 2,092 parts In-Stock

1+ parts

$10.423

100+ parts

$8.547

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2,092

$10.423

$8.547

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$10.423

100+ parts

$9.902

1k+ parts

$9.381

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1,812

$10.423

$9.902

$9.381

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$17.381

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766

$17.381

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One Stop Electronics

USA . 1,593 parts In-Stock

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$24.000

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1,593

$24.000

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DigiPath Technology Company

USA . 2,232 parts In-Stock

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$9.397

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2,232

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$9.397

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Corphita

USA . 1,976 parts In-Stock

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1,976

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Overview

Experience unparalleled quality and reliability with the SNJ54ALS518FH from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch performance in digital arithmetic circuits. Ideal for military applications, this product offers customers unmatched value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and stability, making it suitable for high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and improving reliability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage allows for compatibility with a wide range of systems and circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended use.

Technology: TTL

TTL technology offers high speed operation and low power consumption, making it ideal for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS518FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54ALS518FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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