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SN74LS683N3

Texas Instruments

SN74LS683N3 by Texas Instruments

SN74LS683N3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals and a supply voltage of 5V. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations in various electronic systems. The package style is in-line rectangular shape with through-hole terminals, ideal for robust and reliable circuit connections.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,339 parts In-Stock

1+ parts

-

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8,339

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Digiode

USA . 258 parts In-Stock

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258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,304 parts In-Stock

1+ parts

$9.968

100+ parts

-

1k+ parts

$9.569

10k+ parts

$9.569

3,304

$9.968

-

$9.569

$9.569

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$14.443

100+ parts

-

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510

$14.443

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Parana Technologies

USA . 1,047 parts In-Stock

1+ parts

$28.976

100+ parts

-

1k+ parts

$53.875

10k+ parts

-

1,047

$28.976

-

$53.875

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DigiPath Technology Company

USA . 984 parts In-Stock

1+ parts

$31.906

100+ parts

$29.353

1k+ parts

-

10k+ parts

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984

$31.906

$29.353

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ChromeModa Solutions

Germany . 4,038 parts In-Stock

1+ parts

$32.557

100+ parts

$26.697

1k+ parts

-

10k+ parts

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4,038

$32.557

$26.697

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IDEA Electronic Components Group

UK . 1,598 parts In-Stock

1+ parts

$32.557

100+ parts

$30.929

1k+ parts

$29.301

10k+ parts

-

1,598

$32.557

$30.929

$29.301

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One Stop Electronics

USA . 1,203 parts In-Stock

1+ parts

$55.000

100+ parts

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1,203

$55.000

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Corphita

USA . 1,817 parts In-Stock

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1,817

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Overview

Unlock the power of efficient digital arithmetic circuits with the SN74LS683N3 by Texas Instruments. Crafted from high-quality materials and backed by a reputable manufacturer, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile component provides customers with the value, benefits, and advantages they need to take their projects to the next level. Trust Texas Instruments for innovative solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product easy to handle and reducing overall weight.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic systems and designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with many existing systems and power sources.

Maximum Operating Temperature: 70 °C

Can operate efficiently at higher temperatures, ensuring reliability in different environmental conditions.

Technology: TTL

Uses Transistor-Transistor Logic technology, known for its high speed and low power consumption, making it an efficient choice for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SN74LS683N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS683N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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