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SN74HC147NP1

Texas Instruments

SN74HC147NP1 by Texas Instruments

SN74HC147NP1 by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies of 2-6V, it is commonly used in various electronic systems requiring precise arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,329 parts In-Stock

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7,329

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Digiode

USA . 2,299 parts In-Stock

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2,299

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Distributors (Availability)

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Andel Nordic

Denmark . 2,871 parts In-Stock

1+ parts

$6.433

100+ parts

-

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$6.176

10k+ parts

$6.176

2,871

$6.433

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$6.176

$6.176

One Stop Electronics

USA . 1,624 parts In-Stock

1+ parts

$14.000

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1,624

$14.000

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AZTECH Wire

Italy . 749 parts In-Stock

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$14.894

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749

$14.894

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Parana Technologies

USA . 710 parts In-Stock

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$15.265

100+ parts

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$15.660

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710

$15.265

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$15.660

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DigiPath Technology Company

USA . 1,697 parts In-Stock

1+ parts

$16.809

100+ parts

$15.464

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1,697

$16.809

$15.464

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IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$17.152

100+ parts

$16.294

1k+ parts

$15.437

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1,525

$17.152

$16.294

$15.437

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ChromeModa Solutions

Germany . 1,428 parts In-Stock

1+ parts

$17.152

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$14.065

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1,428

$17.152

$14.065

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Corphita

USA . 2,789 parts In-Stock

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2,789

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Overview

Revolutionize your digital arithmetic circuits with the SN74HC147NP1 by Texas Instruments. Known for their quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile product is perfect for a wide range of applications, providing unmatched value and performance. Upgrade your projects with ease and precision using the SN74HC147NP1, setting new benchmarks in efficiency and functionality. Trust Texas Instruments to deliver the innovation you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product suitable for industrial environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation into existing systems or circuits.

Power Supplies (V): 2/6

Wide range of power supply options (2V-6V) provide flexibility in different voltage requirements and applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and versatility in circuit design.

Package Style (Meter): IN-LINE

In-line package style saves space and enables efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various operating conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides stable connections and enhances signal integrity.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy soldering and mounting onto PCBs for secure connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for compatibility and easy integration into existing circuit designs.

Technical Specifications

Digital Arithmetic Circuits SN74HC147NP1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC147NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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