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SN74S283FN3

Texas Instruments

SN74S283FN3 by Texas Instruments

SN74S283FN3 by Texas Instruments is a TTL digital arithmetic circuit in a 20-terminal chip carrier package. Operating temperature range: 0-70°C. Ideal for commercial applications requiring surface mount technology and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,830 parts In-Stock

1+ parts

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4,830

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Digiode

USA . 4,579 parts In-Stock

1+ parts

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4,579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 301 parts In-Stock

1+ parts

$10.390

100+ parts

-

1k+ parts

$10.904

10k+ parts

-

301

$10.390

-

$10.904

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DigiPath Technology Company

USA . 1,408 parts In-Stock

1+ parts

$11.441

100+ parts

$10.525

1k+ parts

-

10k+ parts

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1,408

$11.441

$10.525

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ChromeModa Solutions

Germany . 3,564 parts In-Stock

1+ parts

$11.674

100+ parts

$9.573

1k+ parts

-

10k+ parts

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3,564

$11.674

$9.573

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IDEA Electronic Components Group

UK . 660 parts In-Stock

1+ parts

$11.674

100+ parts

$11.090

1k+ parts

$10.507

10k+ parts

-

660

$11.674

$11.090

$10.507

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$14.508

100+ parts

-

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873

$14.508

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One Stop Electronics

USA . 630 parts In-Stock

1+ parts

$44.000

100+ parts

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630

$44.000

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Corphita

USA . 554 parts In-Stock

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554

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Overview

Elevate your digital arithmetic circuits with the SN74S283FN3 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a cutting-edge solution that offers unmatched performance in a wide range of applications. Whether you're designing complex mathematical operations or implementing logic functions, this product delivers exceptional value, benefits, and advantages to meet your needs. Trust Texas Instruments to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components, providing durability and protection for the circuitry inside.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and place onto the circuit board, ensuring a secure fit.

No. of Terminals: 20

Having 20 terminals allows for a higher level of connectivity and functionality within the circuit, making it suitable for complex arithmetic operations.

Package Style (Meter): CHIP CARRIER

The chip carrier style of package is compact and efficient, ideal for applications where space is limited.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can perform reliably in a variety of environments without risk of overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can still function effectively in colder conditions, providing versatility in usage.

Terminal Position: QUAD

The quad terminal position allows for efficient connectivity and signal transmission between the circuit and external components.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that this product is suitable for a wide range of industrial and consumer applications.

Technology: TTL

TTL technology offers fast processing speeds and low power consumption, making this product efficient for arithmetic calculations.

Terminal Form: J BEND

The J bend terminal form provides a secure connection to the circuit board, reducing the risk of disconnection or signal loss.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density integration onto the circuit board, enabling more functionality in a compact space.

Technical Specifications

Digital Arithmetic Circuits SN74S283FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74S283FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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