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SN54ALS688FH

Texas Instruments

SN54ALS688FH by Texas Instruments

SN54ALS688FH by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at temperatures from -55 to 125°C. It has a supply voltage of 5V and comes in a ceramic chip carrier package. Ideal for military-grade applications requiring high-speed arithmetic operations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,850 parts In-Stock

1+ parts

-

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3,850

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Digiode

USA . 2,667 parts In-Stock

1+ parts

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2,667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$6.049

100+ parts

-

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516

$6.049

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Parana Technologies

USA . 2,186 parts In-Stock

1+ parts

$7.461

100+ parts

-

1k+ parts

$7.949

10k+ parts

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2,186

$7.461

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$7.949

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$8.215

100+ parts

$7.558

1k+ parts

-

10k+ parts

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228

$8.215

$7.558

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ChromeModa Solutions

Germany . 1,736 parts In-Stock

1+ parts

$8.383

100+ parts

$6.874

1k+ parts

-

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1,736

$8.383

$6.874

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IDEA Electronic Components Group

UK . 888 parts In-Stock

1+ parts

$8.383

100+ parts

$7.964

1k+ parts

$7.545

10k+ parts

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888

$8.383

$7.964

$7.545

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One Stop Electronics

USA . 1,555 parts In-Stock

1+ parts

$15.000

100+ parts

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1,555

$15.000

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Corphita

USA . 4,202 parts In-Stock

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4,202

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Overview

Upgrade your digital arithmetic circuits with the high-quality SN54ALS688FH from Texas Instruments. This square-shaped chip carrier is designed for military-grade applications, providing reliable performance in extreme temperatures ranging from -55°C to 125°C. With 20 terminals and a 5V power supply, this surface-mount device offers superior functionality and efficiency. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the SN54ALS688FH and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and resistance to environmental factors, making it suitable for harsh operating conditions.

Surface Mount: YES

Surface mountability enables easy and efficient integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, compatible with many digital systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the circuit can withstand elevated temperatures without performance degradation.

Technology: TTL

Utilizes TTL technology known for its high noise immunity, fast response times, and wide operating range, ensuring reliable performance in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN54ALS688FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54ALS688FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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